Effect of bubble behavior on the morphology of foamed porous copper prepared via electrodeposition

Journal of the Electrochemical Society

Volumn 160, Issue 10, 2013, Pages

  Zhang, Hebing ^a   Ye, Yinghua ^a   Shen, Ruiqi ^a   Ru, Chengbo ^a   Hu, Yan ^a  

^a NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION TIME; DYNAMIC TEMPLATES; HIERARCHICAL POROUS; HYDROGEN BUBBLES; HYDROGEN EVOLUTION REACTIONS; MACROPOROUS COPPERS; MORPHOLOGICAL TRANSFORMATIONS; TWO-DIMENSIONAL STRUCTURES;

COALESCENCE; COPPER; HYDROGEN; RESIDENCE TIME DISTRIBUTION;

MORPHOLOGY;

EID: 84881562434     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/2.019310jes     Document Type: Article

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