Low-temperature sintering of nanoscale silver paste: A lead-free die-attach solution for high-performance and high-temperature electronic packaging

Proceedings - 2006 IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2006

Volumn , Issue , 2006, Pages 135-140

  Bai, J G ^a,b   Zhang, Z ^a,b   Calata, J N ^a,b   Lei, T ^a,b   Lu, G Q ^a,b  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALTERNATIVE MATERIALS; HIGH-TEMPERATURE ELECTRONICS; LOW-TEMPERATURE SINTERING; NANOSCALE SILVER PASTE; PERFORMANCE AND RELIABILITIES; THERMAL AND MECHANICAL PROPERTIES; THERMAL CYCLING TEST; THERMOMECHANICAL RELIABILITY;

COALESCENCE; DIES; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; SEMICONDUCTOR DEVICES; SILICON CARBIDE; SILVER; SINTERING;

THERMAL CONDUCTIVITY;

EID: 84879854153     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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