Thermal-structural performance of orthotropic pin fin in electronics cooling applications

Journal of Electronic Packaging

Volumn 134, Issue 4, 2012, Pages

  Arif, A F M ^a   Zubair, Syed M ^a   Pashah, S ^a  

^a KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS   (Saudi Arabia)

Author keywords

composite material; electronic cooling; finite element analysis; heat sink; orthotropic material; pin fin

Indexed keywords

COMPOSITE MATERIALS; ELECTRONIC COOLING; FINITE ELEMENT METHOD; FINS (HEAT EXCHANGE); HEAT SINKS; MICROELECTRONICS; SURFACE ROUGHNESS;

CONDUCTIVE COMPOSITES; ELECTRONICS COOLING; MICRO ELECTRONICS COOLING; ORTHOTROPIC MATERIALS; PIN-FINS; STRUCTURAL BEHAVIORS; STRUCTURAL PERFORMANCE; STRUCTURAL RESPONSE;

INTERFACES (MATERIALS);

EID: 84868363026     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4007258     Document Type: Article

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