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Volumn , Issue , 1998, Pages 55-62
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Roadmap to low cost bumping for DCA, COF, CSP and BGA
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
ASSEMBLY;
CONDUCTIVE MATERIALS;
COPPER;
COST EFFECTIVENESS;
ELECTROLESS PLATING;
ELECTRONICS PACKAGING;
FLIP CHIP DEVICES;
GOLD PLATING;
METALLIZING;
NICKEL PLATING;
SOLDERING ALLOYS;
ANISOTROPIC CONDUCTIVE ADHESIVES;
BALL GRID ARRAYS (BGA);
DIRECT CHIP ATTACH (DCA) METHOD;
ELECTROLESS BUMPING;
PRINTED CIRCUIT MANUFACTURE;
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EID: 0031619261
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (4)
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References (11)
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