Low temperature bonding of high density large area array interconnects for 3D integration

43rd International Symposium on Microelectronics 2010, IMAPS 2010

Volumn , Issue , 2010, Pages 28-35

  Reed, Jason D ^a   Lueck, Matthew ^a   Gregory, Chris ^a   Huffman, Alan ^a   Lannon, John M ^a   Temple, Dorota S ^a  

^a RTI INTERNATIONAL   (United States)

Author keywords

3D IC thermocompression bonding; High density die to die interconnect

Indexed keywords

HIGH-DENSITY DIE-TO-DIE INTERCONNECT; INTER-METALLIC COMPOUNDS; INTERCONNECT DENSITIES; LOW TEMPERATURE BONDING; LOW THERMAL BUDGET; LOW- TEMPERATURE PROCESS; THERMO COMPRESSION BONDING; THERMO-COMPRESSION;

BONDING; INTERMETALLICS; MICROELECTRONICS; SOLDERING ALLOYS; TEMPERATURE; THREE DIMENSIONAL COMPUTER GRAPHICS;

COPPER COMPOUNDS;

EID: 84878202136     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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