Use of conductive adhesive for MEMS interconnection in ammunition fuze applications

Journal of Micro/Nanolithography, MEMS, and MOEMS

Volumn 9, Issue 4, 2010, Pages

  Gakkestad, Jakob ^a   Dalsjo, Per ^a   Kristiansen, Helge ^b   Johannessen, Rolf ^c   Taklo, Maaike M Visser ^c  

^a NORWEGIAN DEFENCE RESEARCH ESTABLISHMENT FFI   (Norway)

^b Mosaic Solutions AS and Conpart AS   (Norway)

^c SINTEF   (Norway)

Author keywords

Conductive adhesive; Fuze; Microelectromechanical system; Packaging; Polymer spheres; Reliability

Indexed keywords

AMMUNITION; COMPOSITE MICROMECHANICS; MECHANICAL PROPERTIES; MEMS; MICROELECTROMECHANICAL DEVICES; TESTING; THERMODYNAMIC PROPERTIES;

CENTRIPETAL ACCELERATION; CONDUCTIVE ADHESIVE; FIRING TESTS; FUZE; MECHANICAL AND THERMAL PROPERTIES; MEDIUM-CALIBER AMMUNITIONS; MICRO ELECTRO MECHANICAL SYSTEM; PAD SIZES; POLYMER SPHERES; RAPID TEMPERATURE; TEMPERATURE CYCLES; TEST CONDITION; TEST STRUCTURE;

PRINTED CIRCUIT BOARDS;

EID: 79960394442     PISSN: 19325150     EISSN: 19325134     Source Type: Journal    
DOI: 10.1117/1.3504691     Document Type: Conference Paper

References (7)

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4. J. Gakkestad, P. Dalsjo, H. Kristiansen, R. Johannessen, and M. M. V. Taklo, "Use of conductive adhesive for MEMS interconnection in military fuze applications," Proc. SPIE 7592, 75920I (2010).
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