3D integration technologies for miniaturized tire pressure monitor system (TPMS)

International Conference and Exhibition on Device Packaging 2009

Volumn 1, Issue , 2008, Pages 296-322

  Lietaer, Nicolas ^a   Taklo, Maaike M V ^a   Klumpp, Armin ^b   Ramm, Peter ^b  

^a SINTEF   (Norway)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84877731379     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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2. http://ecubes.org
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4. Plan Optik AG, Ueber der Blitz 3, 56479 Elsoff, Germany
5. M. Taklo, M. Mielnik, K. Schjølberg-Henriksen Kari, P. Storås, H. Rosquist, N. Lietaer, R. Johannessen, "Technologies enabling 3D stacking of MEMS", IEEE workshop on 3D System Integration, Munich, oct 1-2 2007
6. P. Ramm, M. M. V. Taklo, J. M. Wolf, "3D Integration Technologies for Wireless Sensor Systems (e-CUBES)", IMAPS Int. Conf. Device Packaging, Scottsdale, mar 17 - 20 (2008)
7. M. M. V. Taklo et al, "MEMS Sensor/IC Integration for Miniaturized TPMS (e-CUBES)", SEMATECH: Manufacturing and reliability challenges for 3D Ics using TSVs, San Diego, California, sep 25-26 2008
8. K. Schjølberg-Henriksen et al., "Miniaturised sensor node for tire pressure monitoring (e-CUBES)", to be presented at AMAA 13th International Forum on Advanced Microsystems for Automotive Applications, mai 5-6 2009, Berlin
9. N. Lietaer, P. Storås, L. Breivik, S. Moe, "Development of cost-effective high-density through-wafer interconnects for 3D microsystems", J Micromech MicroEng, Vol. 16, pp.S29-S34, 2006.
10. Kulicke and Soffa Ind Inc, 1005 Virginia Drive, Fort Washington, PA 19034, USA
11. Datacon, Innstrasse 16, A-6240 Radfeld, Austria
12. Fraunhofer IZM, Gustav-Meyer-Allee 25, Building 17°, D-13355 Berlin, Germany