Thermal and thermo-oxidative aging effects on the dielectric properties of thin polyimide films coated on metal substrate

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

Volumn , Issue , 2011, Pages 52-55

  Khazaka, R ^a   Diaham, S ^a   Locatelli, M L ^a   Trupin, C ^a   Schlegel, B ^a  

^a d'Hydraulique et des Telecommunications   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BREAKDOWN FIELD; BULK EFFECT; C APPLICATION; DC CONDUCTIVITY; DIELECTRIC STRENGTHS; ELECTRICAL CONDUCTIVITY; ELECTRONIC APPLICATION; FILM CHARACTERISTICS; HIGH TEMPERATURE; INERT ATMOSPHERES; INSULATING LAYERS; LIFE-TIMES; MACROMOLECULAR STRUCTURES; METAL SUBSTRATE; OPERATING DEVICES; OXYGEN DIFFUSION; PI FILM; POLYIMIDE FILM; REDUCTION RATE; REST TIME; STAINLESS STEEL SUBSTRATES; THERMO-OXIDATIVE; THERMO-OXIDATIVE AGING; THICKNESS REDUCTION;

DEGRADATION; DIELECTRIC PROPERTIES; ELECTRIC CONDUCTIVITY; HIGH TEMPERATURE APPLICATIONS; NITROGEN; POLYIMIDES; POLYMERIC FILMS; STABILIZATION; SUBSTRATES; SURFACE ROUGHNESS; THIN FILMS;

PHASE INTERFACES;

EID: 84864650937     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CEIDP.2011.6232594     Document Type: Conference Paper

References (16)

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