3D technologies at CEA-leti minatec

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference

Volumn , Issue , 2008, Pages 318-324

  Cioccio, Léa Di ^a   Gueguen, P ^a   Grossi, F ^a   Leduc, P ^a   Charlet, B ^a   Assous, M ^a   Mathewson, A ^a   Brun, J ^a   Henry, D ^a   Batude, P ^a   Coudrain, P ^a   Sillon, N ^a   Clavelier, L ^a   Poupon, G ^a   Scannell, M ^a  

^a CEA LETI   (France)

Author keywords

3D integration; Copper bonding; Direct bonding; Self assembly; Through silicon via

Indexed keywords

3-D INTEGRATION; DEVELOPED APPLICATIONS; DIRECT BONDING; HETEROGENEOUS INTEGRATION; LOW TEMPERATURE BONDING; SELF-ASSEMBLY TECHNIQUE; THREE DIMENSIONAL INTEGRATION; THROUGH-SILICON-VIA;

ALIGNMENT; BONDING; COPPER; EXHIBITIONS; SELF ASSEMBLY; THREE DIMENSIONAL COMPUTER GRAPHICS;

WAFER BONDING;

EID: 84877274319     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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