Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array

IEEE Design and Test of Computers

Volumn 23, Issue 3, 2006, Pages 212-219

  Kam, Dong Gun ^a   Kim, Joungho ^a   Yu, Jiheon ^b   Choi, Ho ^b   Bae, Kicheol ^b   Lee, Choonheung ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Amkor Technology Korea Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; PRODUCT DESIGN; THREE DIMENSIONAL;

PLASTIC BALL GRID ARRAY; SYSTEM-IN-PACKAGE; WIRE-BONDING;

CHIP SCALE PACKAGES;

EID: 33744524127     PISSN: 07407475     EISSN: None     Source Type: Journal    
DOI: 10.1109/MDT.2006.78     Document Type: Article

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