Compensation of ESD and input capacitance effect by using package bondwire inductance for over Gbps differential SerDes devices

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 159-162

  Ahn, Seungyoung ^a   Park, Jongbae ^a   Chung, Daehyun ^a   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; ELECTRONICS PACKAGING; INDUCTANCE; TIME DOMAIN ANALYSIS;

BONDWIRE; INPUT CAPACITANCE; SIMULATIONS AND MEASUREMENTS; TIME DOMAIN;

PACKAGING;

EID: 78650940825     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250022     Document Type: Conference Paper

References (6)

1. Caggiano, M.F. et at, "RF electrical measurements of fine pitch BGA packages, " IEEE Transactions on Components and Packaging Technologies, Vol. 24, Issue 2, June 2001.
2. Junho Lee et al, "Over 20 GHz Microwave Frequency Model of Fine Pitch Ball Grid Array (FPBGA) Bonding, " IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 111-114, Oct. 2000.
3. Woonghwan Ryu, et al, "High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm, " IEEE Transactions on Components and Packaging Technologies, Vol. 23, Issue 3, pp. 542-545, Sept. 2000.
4. Seungyoung Ahn, et al, "10 GHz Differential Line Modeling of Leadframe-type TQFP Package for High-Speed Serial Interconnection Systems, " 7th IEEE Workshop on Signal Propagation on Interconnects, pp. 43-46, May 2003.
5. B. Kleveland, et al, "Distributed ESD protection for high-speed integrated circuits" IEEE Electron Device Letters, Vol. 21, Issue 8, pp. 390-392, Aug. 2000.
6. David M. Pozar, "Microwave Engineering, " Second edition 1998.