Anomalous reliability behaviour of 99.99% and 99.999% pure aluminium wire bonds under thermal cycling

Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008

Volumn , Issue , 2008, Pages 658-665

  Agyakwa, P A ^a   Loh, W S ^b   Corfield, M R ^b   Liotti, E ^c   Hogg, S C ^c   Johnson, C M ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

^b UNIVERSITY OF SHEFFIELD   (United Kingdom)

^c LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Hardness; Life prediction; Microstructure; Reliability; Thermal cycling; Wire bonding

Indexed keywords

EMPIRICAL RELATIONSHIPS; HIGH TEMPERATURE PHASE; LIFE PREDICTIONS; LOW TEMPERATURE PHASE; LOWER PEAK TEMPERATURES; MICROSTRUCTURAL CHARACTERISATION; NANO-INDENTATION HARDNESS; WIRE BONDING;

ANNEALING; DUCTILE FRACTURE; ELECTRONICS PACKAGING; HARDNESS; MICROELECTRONICS; MICROSTRUCTURE; RELIABILITY; WIRE;

THERMAL CYCLING;

EID: 84876911647     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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