Copper flip chip bump interconnect technology for microwave subsystems including RF characterization

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 335-338

  Wong, A ^a   Linton, D ^a  

^a QUEEN'S UNIVERSITY BELFAST   (United Kingdom)

Author keywords

Copper; Fabrication; Flip chip; Integrated circuit interconnections; Microwave technology; Microwave theory and techniques; MMICs; Packaging; Prototypes; Radio frequency

Indexed keywords

CHIP SCALE PACKAGES; CONSUMER PRODUCTS; COPPER; ELECTRONICS PACKAGING; FABRICATION; FLIP CHIP DEVICES; MICROWAVE DEVICES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PACKAGING;

FLIP CHIP; INTEGRATED CIRCUIT INTERCONNECTIONS; MICROWAVE TECHNOLOGY; MICROWAVE THEORY AND TECHNIQUES; PROTOTYPES; RADIO FREQUENCIES;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84876893554     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906396     Document Type: Conference Paper

References (10)

1. Castaldi, S; Fritz, D; Schaeffer, R, "Limits of Copper Plating in High Aspect Ratio Microvias", Circuit World, Vol. 25, No. 2, 1999, pp. 35-40.
2. Cheng, C.C.; Too, E.; Gerst, P.; Hurtubise, R, "Copper Interconnect Process Control for an Insoluble Anode System", Proc. AESF Annual Technical Conference, Cincinnati, USA, 1999, pp. 143-148.
3. Ling, Z; Lian, K; Jian, L; "Improved Patterning Quality of SU-8 Microstructures by Optimizing the Exposure Parameters", Proc. of SPIE (International.Society for Optical Engineering), Vol. 3999 Part 2, 2000, pp. 1019-1027.
4. Ono, S; Naitoh, K; Osaka, T; "Initial Propagation Stage of Direct Copper Plating on Non-conducting Substrates", Electrochemica Acta, Vo. 44, No. 21, 1999, pp. 3697-3705.
5. Rigg, P.R; Carroll, J.E; "Low-cost Computer-Based Time-Domain Microwave Network Analyser", IEE Proc., Vol. 127, Pt. H, No. 2, April 1980, pp. 107-111.
6. Somlo, P.I; "The Locating Reflectometer", IEEE Transactions on Microwave Theory and Techniques, Vol. MTT-20, No. 2, Feb. 1972, pp. 105-112.
7. Marks, R.B; "A Multiline Method of Network Analyzer Calibration", IEEE Transactions on Microwave Theory and Techniques, Vol. 39, No. 7, July 1991, pp. 1205-1215.
8. Rehnmark, S; "On the Calibration Process of Automatic Network Analyzer Systems", IEEE Transactions on Microwave Theory and techniques, April 1974, pp. 457-458.
9. Woodin, C; Goff, M; "Verification of MMIC On-Wafer Microstrip TRL Calibration", IEEE Microwave Theory and Techniques Symposium Digest, 1990, pp. 1029-1032.
10. Herman, M.I; Pao, C.K; Lan, G.L; Chen, J.C; "Millimeter-Wave Deembedding Using the Extended TRL (ETRL) Approach", IEEE Microwave Theory and Techniques Symposium Digest, 1990, pp. 1033-1036.