Copper interconnect process control for an insoluble anode system

Proceedings of the AESF Annual Technical Conference

Volumn , Issue , 1999, Pages 143-148

  Cheng, C C ^a   Too, E ^a   Gerst, P ^a   Hurtubise, R ^a  

^a Enthone Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANODES; ELECTRIC PROPERTIES; ELECTROPLATING SOLUTIONS; INTEGRATED CIRCUIT MANUFACTURE; PROCESS CONTROL; SEMICONDUCTOR DEVICE MANUFACTURE; SOLUBILITY;

COPPER SUB-MICRON INTERCONNECTS;

COPPER PLATING;

EID: 0032650617     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)