Thermal verification of a high-temperature power package utilizing silicon carbide devices

Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008

Volumn , Issue , 2008, Pages 1152-1159

  Shaw, R ^a   McPherson, B ^a   Hornberger, J ^a   Lostetter, A ^a   Okumura, K ^b   Otsuka, T ^b  

^a Arkansas Power Electronics International Inc   (United States)

^b ROHM CO LTD   (Japan)

Author keywords

Extreme environment packaging; High temperature packaging; Thermal model verification

Indexed keywords

EXTREME ENVIRONMENT; HIGH-TEMPERATURE PACKAGING; HIGH-TEMPERATURE POWER; INDIVIDUAL COMPONENTS; SELF-REGULATING CURRENT; SILICON CARBIDE DEVICES; THERMAL IMAGING CAMERAS; THERMAL MODEL;

ATMOSPHERIC TEMPERATURE; CHIP SCALE PACKAGES; COMPUTER SIMULATION; INTERFACES (MATERIALS); MICROELECTRONICS; MOSFET DEVICES; POWER ELECTRONICS; RESEARCH; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

SILICON CARBIDE;

EID: 84876735228     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. B. Western, J. Fraley, J. Hornberger, B. McPherson, and A.B. Lostetter, "Reliability of Gold Wire Bond Interconnects in High Temperature (450°C), High Sheer Force (14, 500 G) Applications", IMAPS 2007, San Jose, California, November 2007
2. J. Hornberger, A.B. Lostetter, K.J. Olejniczak, T. McNutt, S.M. Lal, and A. Mantooth, "Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments," IEEE Aerospace Conference Proceedings, Volume 4, March 2004, Page(s): 2538-2555 Vol.4.
3. J. Hornberger, S. Mounce, R. Schupbach, B. McPherson, H. Mustain, A. Mantooth, W. Brown, and A.B. Lostetter, "High-Temperature Integration of Silicon Carbide (SiC) and Silicon-on-Insulator (SOI) Electronics in Multichip Power Modules (MCPMs)," EPE2005, Dresden, Germany, September 2005.
4. J. M. Hornberger, Edgar Cilio, Roberto M. Schupbach, Alexander B. Lostetter and H. Alan Mantooth, "A High-Temperature Multichip Power Module (MCPM) Inverter utilizing Silicon Carbide (SiC) and Silicon on Insulator (SOI) Electronics", PESC 2006-37th IEEE Power Electronics Specialists Conference, pages 9-15, Jeju, South Korea, June 18-22, 2006.
5. B. McPherson, J. Garret, E. Cilio, J. Fraley, J. Hornberger, B. Wester, S. Mounce, R.M Schupbach, and A. B. Lostetter, "Packaging of an Extreme Environment DC Motor Drive for the NASA Venus Lander, IMAPS 2006-39th International Symposium on Microelectronics, October 8-12, 2006. pp. 713-720.
6. R.L. Dietz, S. Anagnostopoulos, and D.P.H. Hasselman, "Interfacial Thermal Resistance, Method of measurement and impact of adhesive," Application Note, DIEMAT, INC.