Packaging of an extreme environment DC motor drive for the NASA venus lander

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 713-720

  McPherson, B ^a   Garrett, J ^a   Cilio, E ^a   Fraley, J ^a   Homberger, J ^a   Western, B ^a   Mounce, S ^a   Schupbach, R M ^a   Lostetter, A B ^a  

^a Arkansas Power Electronics International Inc   (United States)

Author keywords

Extreme environment power electronics packaging; Multichip power module (MCPM); Silicon carbide (SIC)

Indexed keywords

DESIGN CONSIDERATIONS; EXTREME ENVIRONMENT; FINITE ELEMENT ANALYSIS SOFTWARE; MULTICHIP POWER MODULE; PACKAGING TECHNOLOGIES; SILICON CARBIDES (SIC); TECHNOLOGICAL DEVELOPMENT; THERMAL MANAGEMENT STRATEGY;

DC MOTORS; DIGITAL CONTROL SYSTEMS; ELECTRIC DRIVES; ELECTRONIC COOLING; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MICROELECTRONICS; NASA; OSCILLATORS (ELECTRONIC); POWER ELECTRONICS; SOFTWARE RELIABILITY; SURFACES;

SILICON CARBIDE;

EID: 48349136856     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. J. Homberger, A.B. Lostetter, K.J. Olejniczak, S. Magan Lai, and A. Mantooth. " A Novel Three Phase Motor Drive Utilizing Silicon 011 Insulator (SOI) and Silicon-Carbide (SiC) Electronics for Extreme Environment Operation in the Army Future Combat Systems (FCS)." IMAPS 2004. Long Beach. CA. November 2004.
2. E. Kolawa, M. Mojarradi and T. Balint, "Applications of High Temperature Electronics in Space Exploration", HiTEC 2006, Sante Fe, NM. May 2006.
3. William D. Brown. Advanced Electronic Packaging : With Emphasis on Multichip Modules. New York: IEEE Press, 1999.
4. Tullmin, M.; Roberge, P.R., "Corrosion of Metallic Materials", IEEE Transactions on Reliability, Vol. 44. No. 2. June 1995.
5. J. Homberger, S. Mounce, R. Schupbach, B. McPherson, H. Mustain, A. Mantooth, W. Brown, and A.B. Lostetter. "High- Temperature Integration of Silicon Carbide (SiC) and Silicon-on-Insulator (SOI) Electronics in Multichip Power Modules (MCPMs)." European Power Electronics Conference 2005, Dresden Germany.