Reliability of gold wire bond interconnects in high temperature (450°C), high sheer force (14, 500 G) applications

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 562-569

  Western, B ^a   Fraley, J ^a   Hornberger, J ^a   McPherson, B ^a   Lostetter, A B ^a  

^a Arkansas Power Electronics International Inc   (United States)

Author keywords

Gold wire bond reliability; High centripetal Force; High sheer force packaging; High temperature electronics; High temperature packaging

Indexed keywords

CENTRIPETAL FORCE; ELECTRONIC HOUSING; GOLD WIRE; HIGH-TEMPERATURE ELECTRONICS; HIGH-TEMPERATURE PACKAGING; OPERATING ENVIRONMENT; PACKAGING TECHNOLOGIES; SILICON CARBIDE DEVICES;

CHIP SCALE PACKAGES; HIGH TEMPERATURE APPLICATIONS; MICROELECTRONICS; OPTIMIZATION; POWER ELECTRONICS; SILICON CARBIDE; SPEED; SUBSTRATES; TESTING; WIRE;

GOLD;

EID: 84876946741     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. McPherson, B., et al. Packaging of an Extreme Environment DC Motor Drive for the NASA Venus Lander. San Diego, California: IMAPS 2006-39th International Symposium on Microelectronics, October 8-12, 2006. pp. 713-720.
2. McCluskey, F. Patrick, Grzybowski, Richard and Podlesak, Thomas. 5.1 Wire and Wirebonds. High Temperature Electronics. New York: CRC Press, 1997.
3. Harman, George. 3.8 Metallurgical Fatigue of Bonding Wires. Wire Bonding in Microelectronics. San Francisco: McGraw-Hill, 1997.
4. Bond Strength (Destructive Bond Pull Test). s.l.: US Military, March 22, 1989. Vols. MIL-STD-883G, METHOD 2011.7.
5. Mustain, Habib A, Lostetter, Alexander B. and Brown, William D. Evaluation of Gold and Aluminum Wire Bond Performance for High Temperature (500 C) Silicon Carbide (SiC) Power Modules. s.l.: Electronic Components and Technology Conference, 2005.