Transport properties of bulk thermoelectrics - An international round-robin study, Part I: Seebeck coefficient and electrical resistivity

Journal of Electronic Materials

Volumn 42, Issue 4, 2013, Pages 654-664

  Wang, Hsin ^a   Porter, Wallace D ^a   Böttner, Harald ^b   König, Jan ^b   Chen, Lidong ^c   Bai, Shengqiang ^c   Tritt, Terry M ^d   Mayolet, Alex ^e   Senawiratne, Jayantha ^e   Smith, Charlene ^e   Harris, Fred ^f   Gilbert, Patricia ^g   Sharp, Jeff W ^g   Lo, Jason ^h   Kleinke, Holger ⁱ   Kiss, Laszlo ^j  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b FRAUNHOFER INSTITUTE FOR PHYSICAL MEASUREMENT TECHNIQUES IPM   (Germany)

^c SHANGHAI INSTITUTE OF CERAMICS   (China)

^d CLEMSON UNIVERSITY   (United States)

^e Corning Inc ^*  (United States)

^f ZT Plus Inc   (United States)

^g Marlow Industries   (United States)

^h NATURAL RESOURCES CANADA   (Canada)

ⁱ UNIVERSITY OF WATERLOO   (Canada)

^j UNIVERSITÉ DU QUÉBEC À CHICOUTIMI   (Canada)

more..

Author keywords

electrical resistivity; round robin; Seebeck coefficient; Thermoelectric

Indexed keywords

DIMENSIONLESS FIGURE OF MERIT; ELECTRICAL RESISTIVITY; ELECTRONIC TRANSPORT PROPERTIES; INTERNATIONAL ENERGY AGENCY; INTERNATIONAL TEST STANDARD; ROUND ROBIN; THERMAL AND MECHANICAL CYCLING; THERMOELECTRIC;

AUTOMOTIVE INDUSTRY; CHARACTERIZATION; ELECTRIC CONDUCTIVITY; ENERGY EFFICIENCY; MATERIALS HANDLING; SEEBECK COEFFICIENT; TESTING; THERMOELECTRIC EQUIPMENT; THERMOELECTRIC POWER; THERMOELECTRICITY;

TRANSPORT PROPERTIES;

EID: 84876492642     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-2396-8     Document Type: Article

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