Finite element analysis of crystalline silicon solar cell in screen printing process by using Taguchi method

International Journal of Precision Engineering and Manufacturing

Volumn 14, Issue 4, 2013, Pages 635-642

  Lee, Seung Chang ^a   Kim, Chan Ki ^a   Song, Hee Eun ^b   Kim, Young Suk ^a  

^a Kyungpook National University   (South Korea)

^b Korea Institute of Energy Research (KIER)   (South Korea)

Author keywords

Finite element method; Screen printing; Silicon wafer; Taguchi method

Indexed keywords

DESIGN OF EXPERIMENTS; FINITE ELEMENT METHOD; PRINTING PRESSES; SEMICONDUCTOR MATERIALS; SILICON SOLAR CELLS; SILICON WAFERS; TAGUCHI METHODS;

BREAKAGE RATES; CRYSTALLINE SILICON SOLAR CELLS; KEY PROCESS; ON-WAFER; PRINTING CONDITIONS; SCREEN-PRINTING PROCESS; STRESS LEVELS; TAGUCHI DESIGN OF EXPERIMENT;

SCREEN PRINTING;

EID: 84875966747     PISSN: 22347593     EISSN: 20054602     Source Type: Journal    
DOI: 10.1007/s12541-013-0085-z     Document Type: Article

References (23)

1. Shin, J. H., Ahn, S. C., and Oh, S. S., "A study on the reproduction of fine lines according to angle change in screen printing," Journal of the Korean Printing Society, Vol. 11, No. 1, pp. 1-16, 1993.
2. Min, K. J., Nam, S. Y., Kim, G. Y., Choi, B. O., and Ham, Y. B., "A study on method to form PDP barrier rid by screen printing," Proceeding of the Korean Printing Society Conference, pp. 120-126, 2001.
3. Dubey, G. C., "Screens for screen printing of electronic circuits," Micro Electronics Reliability, Vol. 13, No. 3, pp. 203-207, 1974.
4. Dubey, G. C., "The squeegee in printing of electronic circuits," Micro Electronics Reliability, Vol. 14, No. 5-6, pp. 427-429, 1975.
5. Cao, K., Cheng, K., and Wang, Z., "Optimization of screen printing process," Int. Conf. Electronic Packaging Technology, 2006.
6. Buzby, D. and Dobie, A., "Fine line screen printing of thick film pastes on silicon solar cells," International Microelectronics Assembly and Packaging Society, 2008.
7. Neidert, M., Zhang, W., Zhang, D., and Kipka, A., "Screen-printing simulation study on solar cell front side Ag paste," Photovoltaic Specialists Conference, 2008.
8. Zhang, T. Y., Chen, L. Q., and Fu, R., "Measurements of residual stresses in thin films deposited on silicon wafers by indentation fracture," Acta Materialia, Vol. 47, No. 14, pp. 3869-3878, 1999.
9. Vrinceanu, I. D. and Danyluk, S., "Measurement of residual stress in single crystal silicon wafers," Proc. of 8th International Symposium Advanced Packaging Materials, pp. 297-301, 2002.
10. McLaughlin, J. C. and Willoughby, A. F. W., "Fracture of silicon wafers," Journal of Crystal Growth, Vol. 85, No. 1-2, pp. 83-90, 1987.
11. Vodenitcharova, T., Borrero-López, O., and Hoffman, M., "Mechanics prediction of the fracture pattern on scratching wafers of single crystal silicon," Acta Materialia, Vol. 60, No. 11, pp. 4448-4460, 2012.
12. KS M 6518: 2006, "Physical test methods for vulcanized rubber.".
13. KS M ISO 815-1: 2010, "Rubber, vulcanized or thermoplastic-Determination of compression set - Part 1: At ambient or elevated temperatures.".
14. Kim, W. D., Kim, W. S., Kim, D. J., Woo, C. S., and Lee, H. J., "Mechanical testing and nonlinear material properties for finite analysis of rubber components," Transactions of the Korean Society of Mechanical Engineers, Vol. 28, No. 6, pp. 848-859, 2004.
15. ABAQUS, "ABAQUS Version 6. 10-1 Documentation," 2010.
16. Kumar, S. L., Arai, Y., Tsuchida, E., and Yoshida, M., "Plane strain singular field around interface edge using moiré interferometry," SEM X International Congress & Exposition on Experimental & Applied Mechanics, 2004.
17. Kim, K. H. and Lee, J. S., "Introduction to solar cell production," Dooyangsa, pp. 124-133, 2011.
18. Provance, J. D. and Allison, K., "Particle size effects on viscosity of silver pastes - A manufacturer's view," Int. J. for Hybrid Microelectronics, Vol. 6, No. 1, pp. 195-214, 1983.
19. Basham, D. L., Wright, J. W., Ferguson, K. I., and Moy, G. W., "Design: Piers and wharves," United Facilities Criteria, pp. 131-133, 2005.
20. Solar and Energy, "Solar cell metal paste technology and market forecast," Solar and Energy, pp. 70-83, 2010.
21. Shin, B. G., "Fracture behavior of ultra thin single crystalline Si wafer for solar cell," Master thesis, Material Engineering, Seoul National University of Science and Technology, pp. 46-54, 2010.
22. Yoon, H. S., Wu, R., Lee, T. M., and Ahn, S. H., "Geometric optimization of micro drills using Taguchi methods and response surface methodology," Int. J. Precis. Eng. Manuf., Vol. 12, No. 5, pp. 871-875, 2011.
23. Park, K. C. and Kim, Y. S., "The effect of material and process variables on the stamping formability of sheet materials," Journal of Materials Processing Technology, Vol. 51, No. 1-4, pp. 64-78, 1995.