Curing of phenol-formaldehyde resin mixed with wood preservatives

Journal of Applied Polymer Science

Volumn 128, Issue 5, 2013, Pages 2896-2901

  Miyazaki, Junko ^a   Furuta, Naoyuki ^a   Miyauchi, Teruhisa ^a  

^a HOKKAIDO RESEARCH ORGANIZATION   (Japan)

Author keywords

adhesives; differential scanning calorimetry (DSC); resins; thermosets; viscosity and viscoelasticity

Indexed keywords

ANTIFUNGAL COMPOUNDS; DEGREE OF CONVERSION; FUNCTION OF TIME; ISOTHERMAL HEATING; PHENOL-FORMALDEHYDE RESIN; REACTION ENTHALPIES; VISCOSITY AND VISCOELASTICITIES; WOOD PRESERVATIVES;

ACTIVATION ENERGY; ADHESIVES; CURING; PHENOLIC RESINS; PROTECTIVE COATINGS; RESINS; THERMOSETS; VISCOSITY;

DIFFERENTIAL SCANNING CALORIMETRY;

EID: 84874931622     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.38447     Document Type: Article

References (18)

1. Miyazaki, J.,;, Hirabayashi, Y.,;, Furuta, N.,;, Inoue, A.,;, Miyamoto, K.,;, Tohmura, S., In: Proceedings of the 60th annual meetings of the Japan Wood Research Society. Miyazaki, Japan, March 17-19, 2009; The Japan wood research society Ed.; The Japan wood research Society, Tokyo, 2009.
2. Furuta, N.,;, Miyazaki, J.,;, Miyauchi, T.,;, Ohashi, Y., In Proceedings of the Hokkaido Branch of the Japan Wood Research Society Vol 43, Asahikawa, Japan, November 11, The Hokkaido Branch of The Japan Wood Research Society Ed.; The Hokkaido Branch of The Japan Wood Research Society, Sapporo, 2011. Available at: http://www.agr.hokudai.ac.jp/wrsh/files/kouensyuu/Volume43.pdf.
3. Kim, M. G.,;, Nieh, W. L.-S.,;, Meacham, R. M., Ind. Eng. Chem. Res. 1991, 30, 798.
4. Markovic, S.,;, Dunjic, B.,;, Zlatanic, A.,;, Djonlagic J., J. Appl. Polym. Sci. 2001, 81, 1902.
5. He, G.,;, Yan, N., Holzforschung 2005, 59, 635.
6. Wang, J.,;, Laborie, M.-P. G.,;, Wolcott, M. P., Thermochim. Acta 2009, 491, 58.
7. Malkin, A. Y.,;, Kulichikhin, S. G., Adv. Polym. Sci. 1991, 101, 217.
8. King, P. W.,;, Mitchell, R. H.,;, Westwood, A. R., J. Appl. Polym. Sci. 1974, 18, 1117.
9. Holopainen, T.,;, Alvila, L.,;, Rainio, J.,;, Pakkanen, T. T., J. Appl. Polym. Sci. 1997, 66, 1183.
10. Wang, J.,;, Laborie, M.-P. G.,;, Wolcott, M. P., Thermochim. Acta 2005, 439, 68.
11. Vyazovkin, S., J. Comput. Chem. 2001, 22, 178.
12. Friedman, H. L., J. Polym. Sci. 1964, C6, 183.
13. He, G.,;, Riedl, B.,;, Aït -Kadi, A., J. Appl. Polym. Sci. 2003, 89, 1371.
14. He, G.,;, Riedl, B.,;, Aït-Kadi, A., J. Appl. Polym. Sci. 2003, 87, 433.
15. Kenny, J. M.,;, Pisaniello, G.,;, Farina, F.,;, Puzziello, S., Thermochim. Acta 1995, 269/270, 201.
16. Park, B.-D.,;, Riedl, B.,;, Bae, H.-J.,;, Kim, Y. S., J. Wood Chem. Technol. 1999, 19, 265.
17. Jubsilp, C.,;, Punson, K.,;, Takeichi, T.,;, Rimdusit, S., Polym. Degrad. Stab. 2010, 95, 918.
18. Vyazovkin, S. V.,;, Lesnikovich, A. I., Thermochim. Acta 1990, 165, 273.