-
1
-
-
77953133475
-
-
US Patent 5,543,516;
-
Ishida H. US Patent 5,543,516; 1996.
-
(1996)
-
-
Ishida, H.1
-
2
-
-
0030128545
-
Physical and mechanical characterization of near-zero shrinkage polybenzoxazines
-
Ishida H., and Allen D.J. Physical and mechanical characterization of near-zero shrinkage polybenzoxazines. J Polym Sci Polym Phys 34 (1996) 1019-1030
-
(1996)
J Polym Sci Polym Phys
, vol.34
, pp. 1019-1030
-
-
Ishida, H.1
Allen, D.J.2
-
3
-
-
0000212025
-
Curing kinetics of a new benzoxazine-based phenolic resin by differential scanning calorimetry
-
Ishida H., and Rodriguez Y. Curing kinetics of a new benzoxazine-based phenolic resin by differential scanning calorimetry. Polymer 36 (1995) 3151-3158
-
(1995)
Polymer
, vol.36
, pp. 3151-3158
-
-
Ishida, H.1
Rodriguez, Y.2
-
4
-
-
40249102987
-
Synthesis and thermal properties of the thermosetting resin based on cyano functionalized benzoxazine
-
Cao G.P., Chen W.J., and Liu X.B. Synthesis and thermal properties of the thermosetting resin based on cyano functionalized benzoxazine. Polym Degrad Stab 93 (2008) 739-744
-
(2008)
Polym Degrad Stab
, vol.93
, pp. 739-744
-
-
Cao, G.P.1
Chen, W.J.2
Liu, X.B.3
-
5
-
-
34848903972
-
Polybenzoxazines - new high performance thermosetting resins: synthesis and properties
-
Ghosh N.N., Kiskan B., and Yagci Y. Polybenzoxazines - new high performance thermosetting resins: synthesis and properties. Prog Polym Sci 32 (2007) 1344-1391
-
(2007)
Prog Polym Sci
, vol.32
, pp. 1344-1391
-
-
Ghosh, N.N.1
Kiskan, B.2
Yagci, Y.3
-
6
-
-
57449092235
-
Cone calorimetry studies of benzoxazine-epoxy systems flame retarded by chemically bonded phosphorus or silicon
-
Sponton M., Ronda J.C., Galia M., and Cadiz V. Cone calorimetry studies of benzoxazine-epoxy systems flame retarded by chemically bonded phosphorus or silicon. Polym Degrad Stab 94 (2009) 102-106
-
(2009)
Polym Degrad Stab
, vol.94
, pp. 102-106
-
-
Sponton, M.1
Ronda, J.C.2
Galia, M.3
Cadiz, V.4
-
7
-
-
0343526862
-
Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins
-
Rimdusit S., and Ishida H. Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins. Polymer 41 (2000) 7941-7949
-
(2000)
Polymer
, vol.41
, pp. 7941-7949
-
-
Rimdusit, S.1
Ishida, H.2
-
8
-
-
2342588736
-
Advances in addition-cure phenolic resins
-
Nair C.P.R. Advances in addition-cure phenolic resins. Prog Polym Sci 29 (2004) 401-498
-
(2004)
Prog Polym Sci
, vol.29
, pp. 401-498
-
-
Nair, C.P.R.1
-
9
-
-
0036173227
-
Gelation study of high processability and high reliability ternary systems based on benzoxazine, epoxy, and phenolic resins for an application as electronic packaging materials
-
Rimdusit S., and Ishida H. Gelation study of high processability and high reliability ternary systems based on benzoxazine, epoxy, and phenolic resins for an application as electronic packaging materials. Rheologica Acta 41 (2002) 1-9
-
(2002)
Rheologica Acta
, vol.41
, pp. 1-9
-
-
Rimdusit, S.1
Ishida, H.2
-
10
-
-
18844394494
-
Performance improvement of polybenzoxazine by alloying with polyimide: effect of preparation method on the properties
-
Takeichi T., Guo Y., and Rimdusit S. Performance improvement of polybenzoxazine by alloying with polyimide: effect of preparation method on the properties. Polymer 46 (2005) 4909-4916
-
(2005)
Polymer
, vol.46
, pp. 4909-4916
-
-
Takeichi, T.1
Guo, Y.2
Rimdusit, S.3
-
12
-
-
77953139765
-
-
US Patent 6,620,905 B1, 2003
-
Musa OM. US Patent 6,620,905 B1, 2003.
-
-
-
Musa, O.M.1
-
13
-
-
77953126737
-
-
US Patent 6,743,852 B2, 2004
-
Derashen SM, Liu P, Mizori FG. US Patent 6,743,852 B2, 2004.
-
-
-
Derashen, S.M.1
Liu, P.2
Mizori, F.G.3
-
14
-
-
77953132033
-
-
US Patent 6,899,960 B2, 2005
-
Shi SH, Wang L, Chen TA. US Patent 6,899,960 B2, 2005.
-
-
-
Shi, S.H.1
Wang, L.2
Chen, T.A.3
-
15
-
-
0001557266
-
Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine
-
Ishida H., and Rimdusit S. Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine. Thermochim Acta 320 (2001) 177-186
-
(2001)
Thermochim Acta
, vol.320
, pp. 177-186
-
-
Ishida, H.1
Rimdusit, S.2
-
16
-
-
33645140732
-
High performance wood composites from highly filled polybenzoxazine
-
Rimdusit S., Tanthapanichakoon W., and Jubsilp C. High performance wood composites from highly filled polybenzoxazine. J Appl Polym Sci 99 (2006) 1240-1253
-
(2006)
J Appl Polym Sci
, vol.99
, pp. 1240-1253
-
-
Rimdusit, S.1
Tanthapanichakoon, W.2
Jubsilp, C.3
-
17
-
-
0033284593
-
Dynamic mechanical analysis of reactive diluent modified benzoxazine-based phenolic resin
-
Huang M.T., and Ishida H. Dynamic mechanical analysis of reactive diluent modified benzoxazine-based phenolic resin. Polym Polym Compos 7 (1999) 233-247
-
(1999)
Polym Polym Compos
, vol.7
, pp. 233-247
-
-
Huang, M.T.1
Ishida, H.2
-
18
-
-
0032099921
-
Epoxy resin cured by bisphenol A. Based benzoxazine
-
Kimura H., Matsumoto A., Hawegawa K., Ohtsuoka K., and Fukuda A. Epoxy resin cured by bisphenol A. Based benzoxazine. J Appl Polym Sci 68 (1998) 1903-1910
-
(1998)
J Appl Polym Sci
, vol.68
, pp. 1903-1910
-
-
Kimura, H.1
Matsumoto, A.2
Hawegawa, K.3
Ohtsuoka, K.4
Fukuda, A.5
-
19
-
-
0033221635
-
New thermosetting resin from terpenediphenol-based benzoxazine and epoxy resin
-
Kimura H., Murata Y., Matsumoto A., Hasegawa K., Ohtsuka K., and Fukuda A. New thermosetting resin from terpenediphenol-based benzoxazine and epoxy resin. J Appl Polym Sci 74 (1999) 2266-2273
-
(1999)
J Appl Polym Sci
, vol.74
, pp. 2266-2273
-
-
Kimura, H.1
Murata, Y.2
Matsumoto, A.3
Hasegawa, K.4
Ohtsuka, K.5
Fukuda, A.6
-
20
-
-
16244401074
-
Toughening of polybenzoxazine by alloying with urethane prepolymer and flexible epoxy: a comparative study
-
Rimdusit S., Pirstpindvong S., and Tanthapanichakoon W. Toughening of polybenzoxazine by alloying with urethane prepolymer and flexible epoxy: a comparative study. Polm Eng Sci 45 (2005) 288-296
-
(2005)
Polm Eng Sci
, vol.45
, pp. 288-296
-
-
Rimdusit, S.1
Pirstpindvong, S.2
Tanthapanichakoon, W.3
-
21
-
-
0034320888
-
Synthesis and characterization of poly (urethane-benzoxazine) films as novel type of polyurethane/phenolic resin composites
-
Takeichi T., Guo Y., and Agag T. Synthesis and characterization of poly (urethane-benzoxazine) films as novel type of polyurethane/phenolic resin composites. J Polym Sci Polym Chem 38 (2000) 4165-4176
-
(2000)
J Polym Sci Polym Chem
, vol.38
, pp. 4165-4176
-
-
Takeichi, T.1
Guo, Y.2
Agag, T.3
-
22
-
-
34347269163
-
Thermal degradation behaviors of polybenzoxazine and silicon-containing polyimide blends
-
Tiptipakorn S., Damrongsakkul S., Ando S., Hemvichian K., and Sarawut R. Thermal degradation behaviors of polybenzoxazine and silicon-containing polyimide blends. Polym Degrad Stab 92 (2007) 1265-1278
-
(2007)
Polym Degrad Stab
, vol.92
, pp. 1265-1278
-
-
Tiptipakorn, S.1
Damrongsakkul, S.2
Ando, S.3
Hemvichian, K.4
Sarawut, R.5
-
23
-
-
20444446716
-
Effect of alkyl groups of latent cationic catalysts on cure and dynamic mechanical behaviors of epoxy resins
-
Park S.J., and Heo G.Y. Effect of alkyl groups of latent cationic catalysts on cure and dynamic mechanical behaviors of epoxy resins. Macromol Chem Phys 206 (2005) 1134-1139
-
(2005)
Macromol Chem Phys
, vol.206
, pp. 1134-1139
-
-
Park, S.J.1
Heo, G.Y.2
-
24
-
-
0030230943
-
Mechanical characterization of copolymers based on benzoxazine and epoxy
-
Ishida H., and Allen D.J. Mechanical characterization of copolymers based on benzoxazine and epoxy. Polymer 37 (1996) 4487-4495
-
(1996)
Polymer
, vol.37
, pp. 4487-4495
-
-
Ishida, H.1
Allen, D.J.2
-
25
-
-
0033691222
-
Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine, epoxy, and phenlic resins
-
Rimdusit S., and Ishida H. Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine, epoxy, and phenlic resins. J Polym Sci Polym Phys 38 (2000) 1687-1698
-
(2000)
J Polym Sci Polym Phys
, vol.38
, pp. 1687-1698
-
-
Rimdusit, S.1
Ishida, H.2
-
26
-
-
0037129887
-
Learning about epoxy cure mechanism from isoconversional analysis of DSC data
-
Sbirrazzuoli N., and Vyazovkin S. Learning about epoxy cure mechanism from isoconversional analysis of DSC data. Thermochim Acta 388 (2002) 289-298
-
(2002)
Thermochim Acta
, vol.388
, pp. 289-298
-
-
Sbirrazzuoli, N.1
Vyazovkin, S.2
-
27
-
-
33749213901
-
Reaction kinetics in differential thermal analysis
-
Kissinger H.E. Reaction kinetics in differential thermal analysis. Anal Chem 29 (1957) 1702-1706
-
(1957)
Anal Chem
, vol.29
, pp. 1702-1706
-
-
Kissinger, H.E.1
-
28
-
-
0000461518
-
A new method of analyzing thermogravimetric data
-
Ozawa T. A new method of analyzing thermogravimetric data. Bull Chem Soc Jpn 38 (1965) 1881-1886
-
(1965)
Bull Chem Soc Jpn
, vol.38
, pp. 1881-1886
-
-
Ozawa, T.1
-
29
-
-
0000266022
-
A quick direct method for the determination of activation energy from thermogravimetric data
-
Flynn J.H., and Wall L.A. A quick direct method for the determination of activation energy from thermogravimetric data. Polym Lett 4 (1966) 323-328
-
(1966)
Polym Lett
, vol.4
, pp. 323-328
-
-
Flynn, J.H.1
Wall, L.A.2
-
30
-
-
0000894118
-
Kinetics of thermal degradation of char-forming plastics from thermogravimetry. Application to a phenolic plastic
-
Friedman H.L. Kinetics of thermal degradation of char-forming plastics from thermogravimetry. Application to a phenolic plastic. J Polym Sci Part C 6 (1965) 183-195
-
(1965)
J Polym Sci Part C
, vol.6
, pp. 183-195
-
-
Friedman, H.L.1
-
31
-
-
0025109327
-
Cure kinetics of an epoxy-novolac molding compound
-
Hsieh T.H., and Su A.C. Cure kinetics of an epoxy-novolac molding compound. J Appl Polym Sci 41 (1990) 1271-1280
-
(1990)
J Appl Polym Sci
, vol.41
, pp. 1271-1280
-
-
Hsieh, T.H.1
Su, A.C.2
-
32
-
-
0035826127
-
DSC and DEA studies of underfill curing kinetics
-
He Y. DSC and DEA studies of underfill curing kinetics. Thermochim Acta 367-368 (2001) 101-106
-
(2001)
Thermochim Acta
, vol.367-368
, pp. 101-106
-
-
He, Y.1
-
33
-
-
0029637234
-
Catalyzing the curing reaction of a new benzoxazine-based phenolic resin
-
Ishida H., and Rodriguez Y. Catalyzing the curing reaction of a new benzoxazine-based phenolic resin. J Appl Polym Sci 58 (1995) 1751-1760
-
(1995)
J Appl Polym Sci
, vol.58
, pp. 1751-1760
-
-
Ishida, H.1
Rodriguez, Y.2
-
34
-
-
12344320086
-
The kinetics of B-a and P-a type copolybenzoxazine via the ring opening process
-
Su Y.C., Yei D.R., and Chang F.C. The kinetics of B-a and P-a type copolybenzoxazine via the ring opening process. J Appl Polym Sci 95 (2005) 730-737
-
(2005)
J Appl Polym Sci
, vol.95
, pp. 730-737
-
-
Su, Y.C.1
Yei, D.R.2
Chang, F.C.3
-
35
-
-
0001427757
-
Kinetic methods to study isothermal and nonisothermal epoxy-anhydride cure
-
Vyazovkin S., and Sbirrazzuoli N. Kinetic methods to study isothermal and nonisothermal epoxy-anhydride cure. Macromol Chem Phys 200 (1999) 2294-2303
-
(1999)
Macromol Chem Phys
, vol.200
, pp. 2294-2303
-
-
Vyazovkin, S.1
Sbirrazzuoli, N.2
-
36
-
-
0242291977
-
A study of epoxy-amine cure kinetics by combining isoconversional analysis with temperature modulated DSC and dynamic rheometry
-
Sbirrazzuoli N., Vyazovkin S., Mititelu A., Sladic C., and Vincent L. A study of epoxy-amine cure kinetics by combining isoconversional analysis with temperature modulated DSC and dynamic rheometry. Macromol Chem Phys 204 (2003) 1815-1821
-
(2003)
Macromol Chem Phys
, vol.204
, pp. 1815-1821
-
-
Sbirrazzuoli, N.1
Vyazovkin, S.2
Mititelu, A.3
Sladic, C.4
Vincent, L.5
-
37
-
-
0037033977
-
Cure kinetics of epoxy resins studied by non-isothermal DSC data
-
Rosu D., Cascaval C.N., Mustata F., and Ciobanu C. Cure kinetics of epoxy resins studied by non-isothermal DSC data. Thermochim Acta 383 (2002) 119-127
-
(2002)
Thermochim Acta
, vol.383
, pp. 119-127
-
-
Rosu, D.1
Cascaval, C.N.2
Mustata, F.3
Ciobanu, C.4
-
38
-
-
33749583083
-
Isoconversional kinetic analysis of thermally stimulated processes in polymers
-
Vyazovkin S., and Sbirrazzuoli N. Isoconversional kinetic analysis of thermally stimulated processes in polymers. Macromol Rapid Comm 27 (2006) 1515-1532
-
(2006)
Macromol Rapid Comm
, vol.27
, pp. 1515-1532
-
-
Vyazovkin, S.1
Sbirrazzuoli, N.2
-
39
-
-
33746052462
-
Thermal analysis and mechanical characterization of maleimide-functionalized benzoxazine/epoxy copolymers
-
Ishida H., and Ohba S. Thermal analysis and mechanical characterization of maleimide-functionalized benzoxazine/epoxy copolymers. J Appl Polym Sci 101 (2006) 1670-1677
-
(2006)
J Appl Polym Sci
, vol.101
, pp. 1670-1677
-
-
Ishida, H.1
Ohba, S.2
-
40
-
-
0342903285
-
Comparative DSC kinetics of thereaction of DGEBA with aromatic diamines. I: non-isothermal kinetic study of the reaction of DGEBA with m-phenylene diamine
-
Zvetkov V.L. Comparative DSC kinetics of thereaction of DGEBA with aromatic diamines. I: non-isothermal kinetic study of the reaction of DGEBA with m-phenylene diamine. Polymer 42 (2001) 6687-6697
-
(2001)
Polymer
, vol.42
, pp. 6687-6697
-
-
Zvetkov, V.L.1
-
41
-
-
33746513057
-
Curing kinetics of arylamine-based polyfunctional benzoxazine resins by dynamic differential scanning calorimetry
-
Jubsilp C., Damrongsakkul S., Takeichi T., and Rimdusit S. Curing kinetics of arylamine-based polyfunctional benzoxazine resins by dynamic differential scanning calorimetry. Thermochim Acta 447 (2006) 131-140
-
(2006)
Thermochim Acta
, vol.447
, pp. 131-140
-
-
Jubsilp, C.1
Damrongsakkul, S.2
Takeichi, T.3
Rimdusit, S.4
-
42
-
-
0026152546
-
A new approach to modeling the cure kinetics of epoxy/amine thermosetting resin. 2. Application to a typical system based on bis[4(diglycidylamino)phenyl] methane and bis(4-aminophenyl) sulfone
-
Cole K.C., Hechler J.J., and Noël D. A new approach to modeling the cure kinetics of epoxy/amine thermosetting resin. 2. Application to a typical system based on bis[4(diglycidylamino)phenyl] methane and bis(4-aminophenyl) sulfone. Macromolecules 24 (1991) 3098-3110
-
(1991)
Macromolecules
, vol.24
, pp. 3098-3110
-
-
Cole, K.C.1
Hechler, J.J.2
Noël, D.3
-
43
-
-
33746274936
-
Isoconversional kinetic analysis of stoichiometric and off-stoichiometric epoxy-amine cures
-
Sbirrazzuoli N., Mija A.M., Vincent L., and Alzina C. Isoconversional kinetic analysis of stoichiometric and off-stoichiometric epoxy-amine cures. Thermochim Acta 447 (2006) 167-177
-
(2006)
Thermochim Acta
, vol.447
, pp. 167-177
-
-
Sbirrazzuoli, N.1
Mija, A.M.2
Vincent, L.3
Alzina, C.4
-
44
-
-
77953128731
-
-
Prime R.B., and Turi A. (Eds), Academic Press, San Diego ([chapter 6])
-
In: Prime R.B., and Turi A. (Eds). Thermal characterization of polymeric materials (1997), Academic Press, San Diego ([chapter 6])
-
(1997)
Thermal characterization of polymeric materials
-
-
-
45
-
-
0034969447
-
Curing behavior of tetrafunctional epoxyresin/hyperbranched polymer system
-
Oh J.H., Jang J., and Lee H. Curing behavior of tetrafunctional epoxyresin/hyperbranched polymer system. Polymer 42 (2001) 8339-8347
-
(2001)
Polymer
, vol.42
, pp. 8339-8347
-
-
Oh, J.H.1
Jang, J.2
Lee, H.3
-
46
-
-
0037162845
-
Contributions of the network structure to the cure kinetics of epoxy resin systems according to the change of hardeners
-
Kim W.G., and Lee J.Y. Contributions of the network structure to the cure kinetics of epoxy resin systems according to the change of hardeners. Polymer 43 (2002) 5713-5722
-
(2002)
Polymer
, vol.43
, pp. 5713-5722
-
-
Kim, W.G.1
Lee, J.Y.2
-
47
-
-
0032140427
-
Kinetics of aryl phosphinate anhydride curing of epoxy resins using differential scanning calorimetry
-
Chen L.W., Fu S.C., and Cho C.S. Kinetics of aryl phosphinate anhydride curing of epoxy resins using differential scanning calorimetry. Polym Int 46 (1998) 325-330
-
(1998)
Polym Int
, vol.46
, pp. 325-330
-
-
Chen, L.W.1
Fu, S.C.2
Cho, C.S.3
|