Reliability of silver sintering on DBC and DBA substrates for power electronic applications

2012 7th International Conference on Integrated Power Electronics Systems, CIPS 2012

Volumn , Issue , 2012, Pages

  Kraft, Silke ^a   Schletz, Andreas ^a   Maerz, Martin ^a  

^a FRAUNHOFER INSTITUTE FOR INTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMMERCIAL DIODES; DIFFERENT SUBSTRATES; DIRECT BONDED COPPERS; FAILURE MECHANISM; POWER ELECTRONIC APPLICATIONS; POWER ELECTRONIC MODULES; RELIABILITY STANDARD; TEMPERATURE CYCLES;

DELAMINATION; FAILURE (MECHANICAL); RELIABILITY; SILVER; SINTERING; WIRE;

SUBSTRATES;

EID: 84874235247     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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