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Volumn , Issue , 2011, Pages

Reliability of insulating substrates - High temperature power electronics for more electric aircraft

Author keywords

high temperature; insulating substrate; power electronics; reliability; silicon carbide

Indexed keywords

ALUMINA CERAMIC; BASE PLATES; DIE ATTACH QUALITY; EXTREME CONDITIONS; FAILURE MECHANISM; FEW-CYCLE; HIGH TEMPERATURE; HIGH TEMPERATURE CYCLING; HIGH TEMPERATURE POWER ELECTRONICS; INSULATING SUBSTRATES; JUNCTION TEMPERATURES; MEAN TEMPERATURE; MORE ELECTRIC AIRCRAFT; SILICON CARBIDE DEVICES; TEMPERATURE CYCLING; TEMPERATURE CYCLING TESTS;

EID: 80053534848     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (16)

References (6)
  • 5
    • 33747750172 scopus 로고    scopus 로고
    • Effects of Metalization Thickness of Ceramic Substrates on the Reliability of Power Assemblies under High Temperature Cycling
    • L.Dupont et al.: Effects of Metalization Thickness of Ceramic Substrates on the Reliability of Power Assemblies under High Temperature Cycling; Microelectronics Reliability 46, 17661771, 2006
    • (2006) Microelectronics Reliability , vol.46 , pp. 17661771
    • Dupont, L.1
  • 6
    • 72649096995 scopus 로고    scopus 로고
    • Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate
    • December
    • T.G. Lei et al.: Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate, IEEE Transaction on Device and Materials Reliability; Vol.9, No.4, December 2009
    • (2009) IEEE Transaction on Device and Materials Reliability , vol.9 , Issue.4
    • Lei, T.G.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.