A three-dimensional theoretical model for predicting transient thermal behavior of thermoelectric coolers

International Journal of Heat and Mass Transfer

Volumn 53, Issue 9-10, 2010, Pages 2001-2011

  Cheng, Chin Hsiang ^a   Huang, Shu Yu ^a   Cheng, Tsung Chieh ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

Experiment; Theoretical model; Thermoelectric cooler; Transient behavior

Indexed keywords

BULK MATERIALS; COEFFICIENT OF PERFORMANCE; DIMENSIONAL TEMPERATURES; EXPERIMENTAL DATA; GEOMETRICAL PARAMETERS; N-TYPE SEMICONDUCTORS; NUMERICAL PREDICTIONS; P-TYPE; SEMICONDUCTOR ELEMENT; SIMULATION MODEL; TEMPERATURE DIFFERENCES; TEMPERATURE VARIATION; THEORETICAL MODELS; THERMAL BEHAVIORS; THERMOELECTRIC COOLER; THERMOELECTRIC ELEMENT; TRANSIENT BEHAVIOR; TRANSIENT TEMPERATURE;

COOLING SYSTEMS; EXPERIMENTS; REFRIGERATORS; TEMPERATURE DISTRIBUTION; THERMOELECTRIC REFRIGERATION; THERMOELECTRICITY; THREE DIMENSIONAL;

THERMOELECTRIC EQUIPMENT;

EID: 76749136137     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2009.12.056     Document Type: Article

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