Two new methods to improve the lithography precision for SU-8 photoresist on glass substrate

Journal of Microelectromechanical Systems

Volumn 22, Issue 1, 2013, Pages 124-130

  Mao, Xu ^a   Yang, Jinling ^a   Ji, An ^a   Yang, Fuhua ^b  

^a INSTITUTE OF SEMICONDUCTORS   (China)

^b STATE KEY LABORATORY OF TRANSDUCER TECHNOLOGY   (China)

Author keywords

Complete absorption; glass substrate; lithography precision; partial reflection; SU 8 photoresist

Indexed keywords

BATCH FABRICATION; BONDING TEMPERATURES; GLASS SUBSTRATES; HIGH PRECISION; LOW COSTS; LOW TEMPERATURE BONDING; OPTICAL TRANSPARENCY; PARTIAL REFLECTION; SCATTERING LIGHT; SI WAFER; SU-8 PHOTORESIST; SU-8 STRUCTURE; ULTRAVIOLET LIGHTS; WAFER CHUCK; WAFER LEVEL;

BONDING; ELECTROMECHANICAL DEVICES; MEMS; PHOTORESISTS; SILICON WAFERS; SUBSTRATES;

LITHOGRAPHY;

EID: 84873295061     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2012.2219295     Document Type: Article

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