Interdependency of mechanical failure rate of encapsulated solar cells and module design parameters

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8472, Issue , 2012, Pages

  Dietrich, Sascha ^a   Sander, Martin ^a   Pander, Matthias ^a   Ebert, Matthias ^a  

^a FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

Author keywords

Finite element simulation; Module mounting; Reliability; Solar cell; Solar module; Weibull analysis

Indexed keywords

ENCAPSULANTS; ESSENTIAL COMPONENT; FINITE ELEMENT MODELS; FINITE ELEMENT SIMULATIONS; GLASS SURFACES; HIGH STIFFNESS; HIGH TEMPERATURE; LOAD CHANGE; LOW TEMPERATURES; MECHANICAL BEHAVIOR; MECHANICAL FAILURES; MECHANICAL RELIABILITY; MODULE DESIGN; POLYMER LAYERS; PRESSURE LOAD; PRINCIPLE STRESS; PROBABILISTIC APPROACHES; PROBABILITY OF FAILURE; RELIABILITY EVALUATION; SIZE EFFECTS; SOLAR MODULE; STIFFNESS VALUES; STRESS FIELD; WEIBULL ANALYSIS;

FINITE ELEMENT METHOD; MOUNTINGS; PHOTOELECTROCHEMICAL CELLS; PHOTOVOLTAIC CELLS; RELIABILITY; RELIABILITY ANALYSIS; STIFFNESS; STRESSES; WEIBULL DISTRIBUTION;

SOLAR CELLS;

EID: 84872120101     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.929289     Document Type: Conference Paper

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