Mechanical and thermo-mechanical assessment of encapsulated solar cells by finite-element-simulation

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7773, Issue , 2010, Pages

  Dietrich, Sascha ^a   Pander, Matthias ^a   Sander, Martin ^a   Schulze, Stefan H ^a   Ebert, Matthias ^a  

^a FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

Author keywords

Encapsulant; Lamination; Reliability; Simulation; Solar cell; Thermal cycling

Indexed keywords

CELL THICKNESS; COEFFICIENT OF THERMAL EXPANSION; CURING TEMPERATURE; ENCAPSULANTS; FINITE-ELEMENT; GLOBAL MODELS; LAMINATION; LAMINATION PROCESS; MATERIAL PROPERTY; MECHANICAL BEHAVIOR; PARAMETER STUDIES; SHEAR MODULUS; SIGNIFICANT IMPACTS; SIMULATION; SIMULATION MODEL; STIFFNESS PROPERTIES; STRESS DISTRIBUTION; SUBMODELS; TEMPERATURE RANGE; THERMO-MECHANICAL; THERMO-MECHANICAL BEHAVIORS; THERMOMECHANICAL ANALYSIS; THIN CELLS;

COMPUTER SIMULATION; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; LAMINATING; MECHANICAL ENGINEERING; MECHANICAL PROPERTIES; PHOTOELECTROCHEMICAL CELLS; PHOTOVOLTAIC CELLS; QUALITY ASSURANCE; RELIABILITY; SOLAR CELLS; STIFFNESS; STRESS CONCENTRATION; THERMAL CYCLING; THERMAL EXPANSION;

CYTOLOGY;

EID: 77957833061     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.860661     Document Type: Conference Paper

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