Textile design application via electroless copper plating

Journal of the Textile Institute

Volumn 103, Issue 12, 2012, Pages 1267-1272

  Guo, R H ^a   Jiang, S X ^b   Yuen, C W M ^b   Ng, M C F ^b  

^a SICHUAN UNIVERSITY   (China)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

copper; design; electroless plating; fabric

Indexed keywords

COPPER; COPPER PLATING; ELECTROLESS PLATING; FABRICS; METALLIC TEXTILES; NICKEL SULFATES; SULFUR COMPOUNDS; TEXTILE INDUSTRY;

COPPER PARTICLES; COPPER PLATING BATHS; DEPOSITION CONDITIONS; DESIGN APPLICATIONS; ELECTROLESS COPPER PLATING; FABRIC SURFACES; SULFATE CONCENTRATIONS; TEXTILE DESIGNS;

DESIGN;

EID: 84870733134     PISSN: 00405000     EISSN: 17542340     Source Type: Journal    
DOI: 10.1080/00405000.2012.675683     Document Type: Article

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