Thermofluidics and energetics of a manifold microchannel heat sink for electronics with recovered hot water as working fluid

International Journal of Heat and Mass Transfer

Volumn 58, Issue 1-2, 2013, Pages 135-151

  Sharma, Chander Shekhar ^a   Tiwari, Manish K ^a   Michel, Bruno ^b   Poulikakos, Dimos ^a  

^a ETH ZURICH   (Switzerland)

^b IBM RESEARCH ZURICH   (Switzerland)

Author keywords

Efficiency; Electronics cooling; Energy; Exergy; Microchannel heat sink; Turbulent flow

Indexed keywords

3D MODELS; COMPLEX FLOW; CONJUGATE HEAT TRANSFER; ELECTRONIC CHIP COOLING; ELECTRONICS COOLING; ENERGY; ENTROPY GENERATION; EXERGY DESTRUCTIONS; FLOW CONDITION; FLUID TEMPERATURES; HEAT TRANSFER STRUCTURES; HIGH REYNOLDS NUMBER; HIGH-FLOW RATE; HOT WATER; LAMINAR FLOW CONDITIONS; LOCAL ENTROPY GENERATION; MANIFOLD MICROCHANNEL; MICRO CHANNEL HEAT SINKS; NET ENTROPY; POROUS MEDIUM; SINGLE MICROCHANNEL; THERMO-HYDRODYNAMIC ANALYSIS; TOTAL ENTROPY; VISCOUS DISSIPATION; WORKING FLUID;

EFFICIENCY; ENTROPY; EXERGY; HEAT SINKS; HEAT TRANSFER; LAMINAR FLOW; MICROCHANNELS; POROUS MATERIALS; RECOVERY; REYNOLDS NUMBER; SECONDARY RECOVERY; THREE DIMENSIONAL; THREE DIMENSIONAL COMPUTER GRAPHICS; TURBULENT FLOW; WATER;

ELECTRONIC COOLING;

EID: 84870673418     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2012.11.012     Document Type: Article

References (36)

1. G.E. Moore Cramming more components onto integrated circuits Electronics 1965 114 117
2. J.G. Koomey Worldwide electricity used in data centers Environ. Res. Lett. 3 3 2008 034008
3. J.G. Koomey Growth in Data Center Electricity Use 2005 to 2010 2011 Analytics Press Oakland, CA
4. S. Sharma, H. Chung-Hsing, F. Wu-chun, Making a case for a Green500 list, in: 20th International Parallel and Distributed Processing Symposium, IPDPS 2006, 2006, p. 8.
5. The Green500 list, 2011. .
6. G.I. Meijer Cooling energy-hungry data centers Science 328 5976 2010 318 319
7. T. Brunschwiler, B. Smith, E. Ruetsche, and B. Michel Toward zero-emission data centers through direct reuse of thermal energy IBM J. Res. Dev. 53 3 2009 11:11 11:13
8. C.S. Sharma, S. Zimmermann, M.K. Tiwari, B. Michel, and D. Poulikakos Optimal thermal operation of liquid-cooled electronic chips Int. J. Heat Mass Transfer 55 7-8 2012 1957 1969
9. P. Kasten, S. Zimmermann, M.K. Tiwari, B. Michel, and D. Poulikakos Hot water cooled heat sinks for efficient data center cooling: towards electronic cooling with high exergetic utility Front. Heat Mass Transfer 1 2 2010 023006
10. D.B. Tuckerman, and R.F.W. Pease High-performance heat sinking for VLSI IEEE Electron Device Lett. 2 5 1981 126 129
11. P.-S. Lee, S.V. Garimella, and D. Liu Investigation of heat transfer in rectangular microchannels Int. J. Heat Mass Transfer 48 9 2005 1688 1704 (Pubitemid 40572468)
12. R. Chein, and J. Chen Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance Int. J. Therm. Sci. 48 8 2009 1627 1638
13. B.J. Jones, P.-S. Lee, and S.V. Garimella Infrared micro-particle image velocimetry measurements and predictions of flow distribution in a microchannel heat sink Int. J. Heat Mass Transfer 51 7-8 2008 1877 1887 (Pubitemid 351295871)
14. D. Copeland, M. Behnia, and W. Nakayama Manifold microchannel heat sinks: isothermal analysis IEEE Trans. Compon. Packag. Manuf. Technol. Part A 20 2 1997 96 102 (Pubitemid 127784990)
15. J.H. Ryu, D.H. Choi, and S.J. Kim Three-dimensional numerical optimization of a manifold microchannel heat sink Int. J. Heat Mass Transfer 46 9 2003 1553 1562 (Pubitemid 36225466)
16. S. Zimmermann, I. Meijer, M.K. Tiwari, S. Paredes, B. Michel, and D. Poulikakos Aquasar: a hot water cooled data center with direct energy reuse Energy 43 1 2012 237 245
17. C. Bailey, K. Dhindsa, K. Pericleous, Low Reynolds number turbulence models for accurate thermal simulations of electronic components, in: 5th Int. Con5 on Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE2004, 2004.
18. B.C. Dhindsa, and K. Pericleous Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications IEEE Trans. Compon. Packag. Technol. 28 4 2005
19. W. Escher, B. Michel, and D. Poulikakos A novel high performance, ultra thin heat sink for electronics Int. J. Heat Fluid Flow 31 4 2010 586 598
20. S.J. Kim, and D. Kim Forced convection in microstructures for electronic equipment cooling J. Heat Transfer 121 3 1999 639 645 (Pubitemid 30001189)
21. ANSYS CFX-Solver Modeling Guide, Release 12.1, ANSYS, Inc., Canonsburg, PA, 2009.
22. ANSYS CFX-Solver Theory Guide, Release 12.1, ANSYS, Inc., Canonsburg, PA, 2009.
23. CRC handbook of chemistry and physics, 2011. .
24. S.B. Pope Turbulent Flows eighth ed. 2000 Cambridge University Press
25. P.H. Forchheimer Wasserbewegun durch Boden Z. Ver. Dtsch. Ing. 45 1901 1782 1788
26. G.S. Beavers, E.M. Sparrow, and D.E. Rodenz Influence of bed size on the flow characteristics and porosity of randomly packed beds of spheres Trans. ASME. E. J. Appl. Mech. 40 3 1973 655 660
27. Y.S. Muzychka, M.M. Yovanovich, Modeling friction factors in non-circular ducts for developing laminar flow, in: Second AIAA Theoretical Fluid Mechanics Meeting, Albuquerque, NM, 1998.
28. P.J. Roache Perspective: a method for uniform reporting of grid refinement studies J. Fluids Eng. 116 3 1994 405 413 (Pubitemid 287898)
29. C.J. Roy Review of code and solution verification procedures for computational simulation J. Comput. Phys. 205 1 2005 131 156
30. Examining spatial (grid) convergence, 2011. .
31. M.D. Salas Some observations on grid convergence Comput. Fluids 35 7 2006 688 692 (Pubitemid 43827404)
32. K. Etessam-Yazdani, M. Asheghi, and H.F. Hamann Investigation of the impact of power granularity on chip thermal modeling using white noise analysis IEEE Trans. Compon. Packag. Technol. 31 1 2008 211 215 (Pubitemid 351447613)
33. M.J. Moran, and H.N. Shapiro Fundamentals of Engineering Thermodynamics fifth ed. 2004 John Wiley & Sons
34. A. Bejan Entropy Generation Minimization: The Method of Thermodynamic Optimization of Finite-Size Systems and Finite-Time Processes 1996 CRC Press
35. F. Kock, and H. Herwig Entropy production calculation for turbulent shear flows and their implementation in cfd codes Int. J. Heat Fluid Flow 26 4 2005 672 680 (Pubitemid 40960343)
36. F. Kock, and H. Herwig Local entropy production in turbulent shear flows: a high-Reynolds number model with wall functions Int. J. Heat Mass Transfer 47 10-11 2004 2205 2215 (Pubitemid 38211621)