Preparation and properties of polyimide nanocomposites with negative thermal expansion nanoparticle filler

Materials Chemistry and Physics

Volumn 137, Issue 2, 2012, Pages 448-457

  Sharma, Gayathri R ^a   Lind, Cora ^b   Coleman, Maria R ^a  

^a Toledo   (United States)

^b UNIVERSITY OF TOLEDO   (United States)

Author keywords

Composite materials; Electron Microscopy (STEM, TEM and SEM); Interfaces; Mechanical testing; Nanostructures; Polymer; Thermal expansion; Thermo mechanical analysis (TMA); Thermogravimetric analysis (TGA)

Indexed keywords

ELECTRON MICROSCOPY (STEM , TEM AND SEM); HYDROTHERMAL METHODS; INTERFACIAL INTERACTION; ISOTROPIC NEGATIVE THERMAL EXPANSION; LINKER GROUPS; LOAD TRANSFER; NANOPARTICLE FILLERS; NEGATIVE THERMAL EXPANSION; ORGANIC MOIETY; POLYIMIDE MATRIX; PREPARATION AND PROPERTIES; ROD-SHAPED; STRUCTURE PROPERTY RELATIONSHIPS; THERMAL EXPANSION PROPERTIES; THERMOMECHANICAL ANALYSIS; VOLUME PERCENTAGE; YOUNG'S MODULUS; ZIRCONIUM TUNGSTATE;

BUOYANCY; COMPOSITE MATERIALS; ELECTRON MICROSCOPY; GLASS TRANSITION; INTERFACES (MATERIALS); MECHANICAL TESTING; NANOCOMPOSITES; NANOPARTICLES; NANOSTRUCTURES; OLIGOMERS; POLYIMIDES; POLYMERS; THERMAL EXPANSION; THERMOGRAVIMETRIC ANALYSIS; TUNGSTEN COMPOUNDS; ZIRCONIUM;

SYNTHESIS (CHEMICAL);

EID: 84870067131     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2012.09.009     Document Type: Article

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