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Volumn 18, Issue 5, 2006, Pages 697-717
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Poly(ester imide)s possessing low coef-cient of thermal expansion and low water absorption
a
TOHO UNIVERSITY
(Japan)
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Author keywords
Flexible printed circuit; In plane orientation; Liner coefficient of thermal expansion; Poly(ester imide)s; Polyimides; Water absorption
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Indexed keywords
COPOLYMERIZATION;
ESTERS;
SYNTHESIS (CHEMICAL);
THERMAL EXPANSION;
WATER ABSORPTION;
X RAY DIFFRACTION;
FLEXIBLE PRINTED CIRCUIT;
IN-PLANE ORIENTATION;
LINER COEFFICIENT OF THERMAL EXPANSION;
POLY(ESTER IMIDE)S;
POLYIMIDES;
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EID: 33748970343
PISSN: 09540083
EISSN: 13616412
Source Type: Journal
DOI: 10.1177/0954008306068231 Document Type: Conference Paper |
Times cited : (95)
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References (38)
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