Composite materials with adjustable thermal expansion for electronic applications

Materials Research Society Symposium - Proceedings

Volumn 445, Issue , 1997, Pages 229-234

  Shi, J D ^a   Pu, Z J ^a   Wu, K H ^a   Larkins, G ^a  

^a FLORIDA INTERNATIONAL UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EPOXY RESINS; INTERFACES (MATERIALS); PLASTICS FILLERS; POLYESTERS; THERMAL EXPANSION; VOLUME FRACTION; ZIRCONIUM COMPOUNDS;

THERMAL EXPANSION COEFFICIENTS; ZIRCONIUM TUNGSTATE;

NONMETALLIC MATRIX COMPOSITES;

EID: 0031382653     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)