Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1062-1068

  Hu, Guojun ^a,b   Tay, Andrew A O ^b   Zhang, Yongwei ^b   Chew, Spencer ^a  

^a Cookson Semiconductor Packaging Materials ^*  (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY MOLDING COMPOUNDS; INTERFACE DELAMINATION; TIME TEMPERATURE SHIFT FACTORS;

DELAMINATION; ELASTIC MODULI; GLASS TRANSITION; PLASTICS MOLDING; RELAXATION TIME; VISCOELASTICITY;

CHIP SCALE PACKAGES;

EID: 35348826653     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373929     Document Type: Conference Paper

References (30)

1. Julian, M.R., "Material Characterization of Viscoelastic Polymeric Molding Compounds", Masters Thesis, The Ohio State University (Columbus, OH, 1994).
2. Kenner, V.H., Julian, M.R. et al, 1996, "Viscoelastic Characterization of an Epoxy-based Molding Compound", Materials Reliability in Microelectronics.
3. Brian D.Harper, Li Lu and Vernal H.Kenner, "Effects of Temperature and Moisture upon the Mechanical Behavior of an Epoxy Molding Compound", ASME Advances in Electronic Packaging, Vol. 19-1 (1997), pp. 1207-1212.
4. G.J. Hu, A.A.O Tay et al, "Material Characterization of Viscoelastic Molding Compound with Application to Delamination Analysis in IC Package", IEEE Electronics Packaging Technology Conference, 2006, pp. 98-104.
5. Yeung, T.S. and Yuen, M.M.F., "Viscoelastic Analysis of IC Packaging Warpage", ASME Sensing, Modeling and Simulation in Emerging Electronic Packaging, EEP-Vol. 17 (1996), pp. 101-107.
6. Driel, W.D.Van, etc., "Packaging Induced Die Stresses-Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound", Journal of Electronic Packaging, Vol. 125 (2003), pp. 520-526.
7. He Yi, "Thermomechanical and Viscoelastic Behavior of a No-flow Underfill Material for Flip-chip Applications", Thermochimica Acta, Vol. 439 (2005), pp. 127-134.
8. Xiong, Z. and Tay, A.A.O., "Modeling of Viscoelastic Effects on Interfacial Delamination in IC Packages", IEEE Electronics Components and Technology Conference, 2000, pp. 1326-1331.
9. Liu, W.N. and Shi, F.G., "Effect of Viscoelastic Behavior of Molding Compounds on Crack Propagation in IC Packages", IEEE Electronics Packaging Technology Conference, 2002, pp. 854-858.
10. Yang, J.H. and Lee, K. Y., "Cracking Analysis of Plastic IC Package in Consideration of Viscoelasticity", IEEE Electronics Packaging Technology Conference, 2000, pp.251-257.
11. Russell, A.J. and Street, K.N, "Moisture and Temperature Effects on the Mixed-Mode Delamination Fracture of Unidirectional Graphite/Epoxy", Delamination and Debonding of Materials, ASTM STP 876 (1985), pp. 349-370.
12. Carlsson, L.A., Gillespie, J.W. and Pipes, R.B., "On the Analysis and Design of the End Notched Flexure (ENF) Specimen for Mode II Testing", Journal of Composite Materials, Vol. 20 (1986), pp. 594-604.
13. Whitney, J.M., "Analysis of the end notched flexure specimen using higher order beam theory based on Reissner's principle," Proceedings of the American Society for Composites 3rd Technical Conference, Lancaster, 1988, pp. 103-112.
14. Wang, Y. and Williams, J.G., "Corrections for Mode II Fracture Toughness Specimens of Composite Materials", Composites Science and Technology, Vol. 43 (1992), pp. 251-256.
15. Asao, N., Isao, H., Naotaka, T., "A New Method for Measuring Adhesion Strength of IC Molding Compounds", Journal of Electronic Packaging, Vol. 114 (1992), pp. 407-412.
16. Rice, J.R., "A Path Independent Integral and Approximate Analysis of Strain Concentration by Notch and Cracks", Journal of Applied Mechanics, Vol. 35 (1968), pp. 379-386.
17. Schapery, R.A., "Correspondence Principles and a Generalized J Integral for Large Deformation and Fracture Analysis of Viscoelastic Media", International Journal of Fracture, Vol. 25 (1984), pp. 195-223.
18. Shih, C.F., B. Moran and T. Nakamura, "Energy Release Rate along a Three-dimensional Crack Front in a Thermally Stresses Body", International Journal of Fracture, Vol. 30 (1986), pp. 79-102.
19. Williams, J.G. and Marshall, G.P., "Environmental crack and craze growth phenomena in polymers", in Proceedings of the Royal Society, London A342 (1975), pp. 55-77.
20. Landes, J.D. and Begley, J. A., "A Fracture Mechanics Approach to Creep Crack Growth", ASTM STP, 590, American Society for Testing and Materials, Philadelphia (1976), pp. 128-148.
21. Ohji, K., Ogura, K. and Kubo, S. Transactions, Japanese Society for Mechanical Engineers, Vol. 42 (1976), pp. 350-358.
22. Nikbin, K.M., Webster, G.A. and Turner, C.E., ASTM STP601, American Society of Testing and Materials (1976), pp. 47-62.
23. t Parameter for Increasing Load Conditions", Fatigue & Fracture of Engineering Materials & Structures, Vol. 22(1999), pp. 859-867.
24. Frassine, R. and Pavan, A., "Viscoelastic Effects on the Interlaminar Fracture Behavior of Thermoplastic Matrix Composites: I. Rate and Temperature Dependent in Unidirectional Pei/Carbon-fiber Laminates", Composites Sciences and Technology, Vol. 54 (1995), pp. 193-200.
25. Asp, L.E., "The Effects of Moisture and Temperature on the Interlaminar Delamination Toughness of a Carbon/Epoxy Composite", Composites Science and Technology, Vol. 58 (1998), pp. 967-977.
26. Landes, J.D., Kim, D.H., "An Analysis of Creep Deformation Parameters Part3: Numerical Evaluation", Engineering Fracture Mechanics, Vol. 71 (2004), pp. 2475-2491.
27. Aliyu, A.A. and Daniel, I.M., "Effects of Strain Rate on Delamination Fracture Toughness of Graphite/Epoxy", Delamination and Debonding of Materials, ASTM STP 876(1985), pp. 336-348.
28. Krawczyk, P. and Jata, K. V., "Influence of Strain Rate on the Fracture Toughness of Al--8 Fe-l V--2 Si at 315°C", Scripta Metallurgica et Materialia, Vol. 24 (1990), pp. 1009-1013.
29. Albert, C., Stefano, M., "Simulation of damage in composites by means of interface models: parameter identification", Composites Science and Technology, Vol. 61 (2001), pp. 2299-2315.
30. G.J. Hu and A.A.O Tay, "On the Relative Contribution of Temperature, Moisture and Vapor Pressure to Delamination in a Plastic IC Package during Lead-Free Solder Reflow", IEEE Electronics Components and Technology Conference, 2005, pp. 172-178.