Array of thermoelectric coolers for on-chip thermal management

Journal of Electronic Packaging

Volumn 134, Issue 2, 2012, Pages

  Sullivan, Owen ^a   Gupta, Man Prakash ^a   Mukhopadhyay, Saibal ^b   Kumar, Satish ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Contact resistance; Hot spot; Peltier; Thermoelectric; Transient

Indexed keywords

CHIP SCALE PACKAGES; COOLING SYSTEMS; ELECTRONIC COOLING; THERMAL MANAGEMENT (ELECTRONICS); THERMOELECTRIC EQUIPMENT;

CURRENT PULSE; ELECTRONIC PACKAGE; HOTSPOTS; ON CHIPS; PEAK TEMPERATURES; PELTIER; THERMAL PROFILES; THERMOELECTRIC; THERMOELECTRIC COOLER; TRANSIENT COOLING;

ENERGY EFFICIENCY;

EID: 84869753191     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4006141     Document Type: Article

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