Fabrication of Pb-free Sn-Bi solder using polyoxyethylene lauryl ether

Advanced Materials Research

Volumn 569, Issue , 2012, Pages 159-163

  Zhang, Shenghong ^a   Chen, Quanfang ^a  

^a University of Central Florida   (United States)

Author keywords

Electrochemical deposition; Polyoxyethylene lauryl ether; Sn Bi alloy

Indexed keywords

BATH COMPOSITIONS; BRIJ 35; COPPER SUBSTRATES; CRYSTALLINE ORIENTATIONS; DIFFERENTIAL SCANNING CALORIMETERS; ELECTROCHEMICAL DEPOSITION; ENERGY DISPERSIVE X RAY SPECTROSCOPY; LEAD FREE SOLDERS; LEAD-FREE SOLDER MATERIALS; PB-FREE; POLYOXYETHYLENE; REFLOW PROCESS; SCANNING ELECTRON MICROSCOPIC; SN-BI ALLOY;

DEPOSITS; DESIGN; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRODEPOSITION; ETHERS; LEAD; ORGANIC COMPOUNDS; POLYETHYLENE OXIDES; REDUCTION; SOLDERING ALLOYS; TIN ALLOYS; X RAY DIFFRACTION; X RAY SPECTROSCOPY;

TIN;

EID: 84869207591     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.569.159     Document Type: Conference Paper

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