Predictive modeling of force and power based on a new analytical undeformed chip thickness model in ceramic grinding

International Journal of Machine Tools and Manufacture

Volumn 65, Issue , 2013, Pages 68-78

  Agarwal, Sanjay ^a   Rao, P Venkateswara ^b  

^a BUNDELKHAND INSTITUTE OF ENGINEERING AND TECHNOLOGY   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

Ceramic grinding; Silicon carbide; Undeformed chip thickness

Indexed keywords

ANALYTICAL MODELS; CERAMIC MATERIALS; DEFLECTION (STRUCTURES); DIAMOND CUTTING TOOLS; FORECASTING; GRINDING WHEELS; OPTIMIZATION; SILICON; SILICON CARBIDE; STOCHASTIC MODELS; STOCHASTIC SYSTEMS; WHEELS;

CERAMIC GRINDING; DIAMOND GRINDING WHEEL; EXPERIMENTAL DETERMINATION; GRINDING TEMPERATURES; PREDICTIVE MODELING; RANDOM DISTRIBUTION; SILICON CARBIDE GRINDING; UNDEFORMED CHIP THICKNESS;

GRINDING (MACHINING);

EID: 84868691289     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2012.10.006     Document Type: Article

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