Predictive modeling of undeformed chip thickness in ceramic grinding

International Journal of Machine Tools and Manufacture

Volumn 56, Issue , 2012, Pages 59-68

  Agarwal, Sanjay ^a   Venkateswara Rao, P ^b  

^a BUNDELKHAND INSTITUTE OF ENGINEERING AND TECHNOLOGY   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

Ceramic grinding; Silicon carbide; Undeformed chip thickness

Indexed keywords

CERAMIC GRINDING; CHIP THICKNESS; CONTACT LENGTH; CONTACT ZONE; CUTTING EDGES; DEPTH OF CUT; EXPERIMENTAL DETERMINATION; GRINDING FORCE; GRINDING PARAMETERS; GRINDING PROCESS; GRINDING SYSTEM; GROUND SURFACES; NEW MODEL; PERFORMANCE EVALUATION; PREDICTIVE MODELING; RANDOM DISTRIBUTION; RANDOM GEOMETRY; REAL CONTACT; SILICON CARBIDE GRINDING; STOCHASTIC NATURE; WORKPIECE MATERIALS;

CERAMIC MATERIALS; COMPETITION; MECHANICAL PROPERTIES; QUALITY CONTROL; SILICON CARBIDE; STOCHASTIC MODELS; SURFACE ROUGHNESS;

GRINDING (MACHINING);

EID: 84857566097     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2012.01.003     Document Type: Article

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