Adhesion improvement of electroless copper to PC substrate by a low environmental pollution MnO2-H3PO4-H 2SO4-H2O system

International Journal of Adhesion and Adhesives

Volumn 41, Issue , 2013, Pages 50-56

  Zhao, Wenxia ^a,b   Wang, Zenglin ^a  

^a SHAANXI NORMAL UNIVERSITY   (China)

^b NINGXIA NORMAL UNIVERSITY   (China)

Author keywords

Adhesion strength; Electroless copper plating; PC surface etching; Surface roughness

Indexed keywords

ADHESION IMPROVEMENT; CHROMIC ACID; COPPER FILMS; ELECTROLESS COPPER; ELECTROLESS COPPER PLATING; ENVIRONMENTAL POLLUTIONS; ETCHING SYSTEMS; ETCHING TREATMENT; SURFACE AVERAGE ROUGHNESS; SURFACE CONTACT ANGLE; SURFACE ETCHING;

ADHESION; BOND STRENGTH (MATERIALS); CONTACT ANGLE; COPPER PLATING; ETCHING; FUNCTIONAL GROUPS; MANGANESE OXIDE; SURFACE CHEMISTRY; SURFACE ROUGHNESS;

SUBSTRATES;

EID: 84868683441     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2012.10.002     Document Type: Article

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