Comparative thermal performance evaluation of graphite/epoxy fin heat sinks

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 410-417

  Shives, Gary ^a   Norley, Julian ^a   Smalc, Martin ^a   Chen, Gary ^a   Capp, Joe ^a  

^a GrafTech International Ltd   (United States)

Author keywords

Aluminum; Copper; Epoxy; Graphite; Heat sink

Indexed keywords

EPOXY ADHESIVES; HEAT FLOW; THERMAL PERFORMANCE;

ALUMINUM; COMPUTER SIMULATION; COPPER; EPOXY RESINS; GRAPHITE; HEAT RESISTANCE; HEAT TRANSFER; LAMINATED COMPOSITES; MATHEMATICAL MODELS; THERMAL CONDUCTIVITY;

FINS (HEAT EXCHANGE);

EID: 4444300151     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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