Soldering-based easy packaging of thin polyimide multichannel electrodes for neuro-signal recording

Journal of Micromechanics and Microengineering

Volumn 22, Issue 11, 2012, Pages

  Baek, Dong Hyun ^a   Han, Chang Hee ^b   Jung, Ha Chul ^a   Kim, Seon Min ^a   Im, Chang Hwan ^b   Oh, Hyun Jik ^a   Pak, James Jungho ^a   Lee, Sang Hoon ^a  

^a Korea University   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANIMAL EXPERIMENTS; BIOSIGNALS; CONTINUOUS MEASUREMENTS; HIGH RESOLUTION; IN-VITRO TESTS; IN-VIVO; MULTI-CHANNEL MICROELECTRODES; MULTICHANNEL ELECTRODES; NEURAL PROSTHETIC; NI-RING; PACKAGING METHODS; SOMATOSENSORY EVOKED POTENTIALS; VIA-HOLE;

ELECTROPLATING; MICROELECTRODES; NICKEL; POLYIMIDES; SOLDERING;

ELECTRIC PROPERTIES;

EID: 84867961633     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/22/11/115017     Document Type: Article

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