Microwave assisted low temperature encapsulation of Ag films by Cu reactions using Ag-Cu alloy structures

Materials Letters

Volumn 89, Issue , 2012, Pages 163-165

  Das, Sayantan ^a   Alford, T L ^a,b  

^a ARIZONA STATE UNIVERSITY   (United States)

^b Arizona State University   (United States)

Author keywords

Electrical properties; Oxidation; Segregation; Thin films

Indexed keywords

AG FILMS; AG-CU ALLOYS; ALLOY FILM; CU ALLOY; ENCAPSULATION LAYER; FOUR-POINT PROBE MEASUREMENTS; LOW TEMPERATURE PROCESSING; LOW TEMPERATURES; MAXIMUM TEMPERATURE; MICROWAVE ASSISTED; MICROWAVE CAVITY; PREFERENTIAL ORIENTATION; RUTHERFORD BACK-SCATTERING SPECTROMETRY;

COPPER; ELECTRIC PROPERTIES; OXIDATION; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SEGREGATION (METALLOGRAPHY); TEMPERATURE; THIN FILMS; X RAY DIFFRACTION;

SILVER;

EID: 84867550289     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2012.08.075     Document Type: Article

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