Enhancement of Ag electromigration resistance by a novel encapsulation process

Materials Letters

Volumn 45, Issue 3, 2000, Pages 157-161

  Zeng, Yuxiao ^a   Chen, Linghui ^a   Zou, Y L ^a   Nyugen, P A ^a   Hansen, J D ^a   Alford, T L ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DIFFUSION IN SOLIDS; ELECTROMIGRATION; ENCAPSULATION; INTEGRATED CIRCUIT MANUFACTURE; METALLIZING; PHOTOLITHOGRAPHY; PLASMA APPLICATIONS; REACTIVE ION ETCHING; STACKING FAULTS; SURFACE PHENOMENA;

ELECTROMIGRATION RESISTANCE;

SILVER;

EID: 0034274642     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(00)00097-5     Document Type: Article

References (23)

1. Black J.R. IEEE Trans. Electron Devices. ED-16:1969;338.
2. Huntington H.B. Nowick A.S., Burton J.J. Diffusion in Solids: Recent Developments. 1974;Academic Press, New York. Chap. 6.
3. Hu C.K., Small M.B., Rodbell K.P., Stanis C., Blauner P. Appl. Phys. Lett. 62:1993;1023.
4. Oates A.S. J. Appl. Phys. 79:1996;163.
5. Hu C.K. Thin Solid Films. 260:1995;124.
6. Gladkikh A., Lereah Y., Karpovski M., Palevski A., Kaganovskii Y.S. Mater. Res. Soc. Symp. Proc. 428:1996;55.
7. Hu C.K., Lee K.L., Gignac L., Carruthers R. Thin Solid Films. 308(9):1997;443.
8. Iijima T., Ono H., Ninomiya N., Ushiku Y., Hatahaka T., Nishiyama A., Iwai H. Extended Abstracts of the Conference on Solid State Devices and Materials, Makuhari. 1993.
9. Alford T.L., Adams D., Laursen T., Manfred Ullrich B. Appl. Phys. Lett. 68:1996;3251.
10. Manepalli R., Stepniak F., Bidstrup S., Kohl P.A. IEEE Transactions-on-Advanced-Packaging. 22:1999;4.
11. Zou Y.L., Alford T.L., Zeng Y.X., Amali A., Laursen T., Ullrich B.M. J. Appl. Phys. 82:1997;3321.
12. Li J., Vizkelethy G., Revesz P., Mayer J.W., Tu K.N. J. Appl. Phys. 69:1991;1020.
13. Singer P. International Semiconductor. 20:1997;54.
14. Berenbaum L., Rosenberg R. Thin Solid Films. 4:1969;187.
15. Breitling H.M., Hummel R.E. J. Phys. Chem. Solids. 33:1972;845.
16. Hummel R.E., Breitling H.M. Appl. Phys. Lett. 18:1971;373.
17. Hummel R.E., Geier H.J. Thin Solid Films. 25:1975;335.
18. Zeng Y.X., Chen L.H., Zou Y.L., Nguyen P.A., Hanson J.D., Alford T.L. Presented in the 1st International Advanced Metallization Materials and Processing Conference, San Jose, CA:1999.
19. Willemsen M.F.C., Kuiper A.E.T., Reader A.H., Hokke R., Barbour J.C. J. Vac. Sci. Technol., B. 6:1988;53.
20. Aggour L., Fitzer E., Wersweiler W. High Temp.-High Pressures. 6:1974;73.
21. Ting C.Y., Wittmer M., Lyer S.S., Brodsky S.B. J. Electrochem. Soc. 131:1984;2934.
22. Russell S.W., Strane J.W., Mayer J.W., Wang S.-Q. J. Appl. Phys. 76:1994;257.
23. Zeng Y., Russell S.W., McKerrow A.J., Chen P., Alford T.L. Thin Solid Films. 360:2000;369.