Combining Laue microdiffraction and digital image correlation for improved measurements of the elastic strain field with micrometer spatial resolution

Procedia IUTAM

Volumn 4, Issue , 2012, Pages 133-143

  Petit, J ^a   Bornert, M ^b   Hofmann, F ^g   Robach, O ^c,e   Micha, J S ^d,e   Ulrich, O ^c,e   Le Bourlot, C ^a,f   Faurie, D ^f   Korsunsky, A M ^g   Castelnau, O ^a  

^a CNRS   (France)

^b UNIVERSITÉ PARIS EST   (France)

^c CEA GRENOBLE   (France)

^d CNRS   (France)

^e EUROPEAN SYNCHROTRON RADIATION FACILITY   (France)

^f UNIVERSITÉ PARIS 13   (France)

^g UNIVERSITY OF OXFORD   (United Kingdom)

Author keywords

Digital images correlation (DIC); Four point bending; Microscopic analysis; Stress field; X ray Laue microdiffraction

Indexed keywords

DIFFRACTION; IMAGE ANALYSIS; IMAGE PROCESSING; IMAGE RESOLUTION; POLYCRYSTALLINE MATERIALS; SILICON WAFERS; STRAIN MEASUREMENT;

DIGITAL IMAGES CORRELATIONS (DIC); FOUR POINT BENDING; MICROSCOPIC ANALYSIS; STRESS FIELD; X-RAY LAUE MICRODIFFRACTION;

SINGLE CRYSTALS;

EID: 84867480941     PISSN: None     EISSN: 22109838     Source Type: Conference Proceeding    
DOI: 10.1016/j.piutam.2012.05.015     Document Type: Conference Paper

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