The history of embedded distributed capacitance

Printed Circuit Design and Manufacture

Volumn 21, Issue 8, 2004, Pages 32-37

  Peiffer, Joel S ^a  

^a 3M COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EMBEDDED DISTRIBUTED CAPACITANCE; EPOXY GLASSES; POWER SUPPLY DECOUPLING; VOLTAGE RIPPLES;

CHIP SCALE PACKAGES; DIELECTRIC MATERIALS; ELECTRIC POTENTIAL; INDUCTANCE; NATURAL FREQUENCIES; NICKEL ALLOYS; PATENTS AND INVENTIONS; POWER SUPPLY CIRCUITS; PRINTED CIRCUIT BOARDS; RESISTORS; SPURIOUS SIGNAL NOISE; THIN FILMS;

CAPACITANCE;

EID: 4344693301     PISSN: 15436527     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (14)

1. NCMS Embedded Decoupling Capacitance (EDC) Project.
2. NIST Advanced Embedded Passives Technology (AEPT) Project.
3. IMAPS ATW on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications, March 2004.
4. DesignCon 2004 TecForum 9: "Thin and VeryThin Laminates for Power Distribution Applications: What is New in 2004?" February 2004.
5. IPC 1st International Conference on Embedded Passives, June 2003.
6. IPC Expo 2003, Embedded Passive Devices I and II, March 2003.
7. DesignCon 2002 TecForum HP-TF2: "Thin PCS Laminates for Power Distribution. How Thin is Thin Enough?" February 2002.
8. J.S. Peiffer, "A Novel Embedded Cap Material," PC FAB, February 2001, pp. 48-52.
9. National Center for Manufacturing Sciences EDC Project Final Report, December 2000.
10. IMAPS ATW on Integrated Passives Technology, April 1998.
11. J.S. Peiffer, "Ultra-Thin, Loaded Epoxy Materials for Use as Embedded Capacitor Layers," PCD&M, April 2004, pp. 40-42.
12. Mike Buetow, "There Was Prior Art, ZBC Inventor Says," PCD&M, November 2003, p. 10.
13. James Howard, "An Open Architecture Approach to Buried Passive Components," PCD&M, December 2003, pp. 40-41.
14. Conversation with Shaun (Dennis) Silverio, coinventor of U.S. Patent 4,494,172.