Ultra-Thin, Loaded Epoxy Materials for Use as Embedded Capacitor Layers

Printed Circuit Design and Manufacture

Volumn 21, Issue 4, 2004, Pages 40-42

  Peiffer, Joel S ^a  

^a 3M COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; DIELECTRIC MATERIALS; EPOXY RESINS; INDUCTANCE; LAMINATES; LASER ABLATION; PRINTED CIRCUIT BOARDS; RESISTORS; SIGNAL INTERFERENCE; SURFACE MOUNT TECHNOLOGY; SWITCHING; ULTRATHIN FILMS;

POWER GROUND CORES; SELF-INDUCTANCE;

CAPACITORS;

EID: 2042542784     PISSN: 15436527     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (11)

1. J. Peiffer, B. Greenlee and I. Novak, "Electrical Performance Advantages of Ultra-Thin Dielectric Materials Used for Power-Ground Cores in High Speed, Multilayer Printed Circuit Boards," IPC Printed Circuits Expo Proceedings, March 2003.
2. M. Xu, T. Hubing, J. Chen, T. Van Doren, J. Drewniak and R. DuBroff, "Power-Bus Decoupling With Embedded Capacitance in Printed Circuit Board Design," IEEE Transactions on Electromagnetic Compatibility, vol. 45, no. 1, February 2003.
3. J. S. Peiffer, NIST Advanced Embedded Passives Technology (AEPT) seminar, January 2003.
4. B. Greenlee, "ProcessingThin Core Capacitor Materials" IPC Printed Circuits Expo Proceedings, March, 2002.
5. B. Greenlee, "Frequently Asked Questions for Printed Circuit Board Fabricators," DesignCon Proceedings, January 2002.
6. I. Novak and V. St. Cyr, "Frequently Asked Questions for Original Equipment Manufacturers," DesignCon Proceedings, January 2002.
7. R. Charbonneau, "NCMS Embedded Decoupling Capacitance Project," DesignCon Proceedings, January 2002.
8. J. S. Peiffer, "Fabrication of Embedded Capacitance Printed Circuit Boards," IPC Printed Circuits Expo Proceedings, April 2001.
9. J. S. Peiffer, "A Novel Embedded Cap Material," PC FAB, vol. 24, no. 2, February 2001.
10. J. S. Peiffer, "Embedded Capacitor Material Evaluation," Apex Proceedings, January 2001.
11. National Center for Manufacturing Sciences, "Embedded Decoupling Capacitance (EDC) Project Final Report," December 2000.