3D-interconnect approach for high end electronics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 1333-1339

  Das, Rabindra N ^a   Egitto, Frank D ^a   Lauffer, John ^a   Bonitz, Barry ^a   Wilson, Bill ^a   Marconi, Francesco ^a   Poliks, Mark D ^a   Markovich, Voya R ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTERCONNECTS; 3D INTERCONNECT; CIRCUIT CARD; DIFFERENT SIZES; EXPENSIVE PRODUCTS; HIGH DENSITY; INTEGRATED APPROACH; INTEGRATION METHOD; INTERCONNECT TECHNOLOGY; MATERIALS AND PROCESS; MICRO PILLARS; MICRO-BUMPS; STACKED DIE; STACKED PACKAGE; WIRING DENSITY;

ELECTRONICS PACKAGING; JOINING; LAMINATED COMPOSITES; PRINTED CIRCUIT BOARDS; TECHNOLOGY;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 84866876709     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6249007     Document Type: Conference Paper

References (8)

1. Rowlands M. and Das R.N., "Manufacture and Characterization of a Novel Flip-Chip Package Z-Interconnect Stack-up with RF Structures" IMAPS (International Microelectronics and Advanced Packaging Society) 40th International Symposium on Microelectronics (November11-15, 2007), pp 758-763.
2. K.Takahashi et'al, "Process integration of 3D chip stack with vertical interconnection." in Proc. 54st Electronic Components and Technology Conf,, Las Vegas, June. 2004, pp. 601-609.
3. Masahiro Sunohara, Takayuki Tokunaga, Takashi Kurihara and Mitsutoshi Higashi, "Silicon Interposer with TSVs (Through Silicon Vias) and Fine Multilayer Wiring", 2008 Electronic Components and Technology Conference Proceedings, 2008 pp847-52.
4. R. Tummala and V. Sundaram, "Impact of 3D ICs with TSV is profound but complex and costly-is there a better way?", Chip Scale review, 8(2011)31-32.
5. http://www.thefreelibrary.com/ Xilinx+announcement+heralds+era+of+silicon+interposers.-a0276276435
6. Frank D. Egitto, Rabindra N. Das, Frank Marconi, Bill Wilson , and Voya R. Markovich , "development of electronic substrates for Medical device applications" International Conference and Exhibition on Device packaging 2007 (Arizona, March 6-8, 2012).
7. S. Movva et al., "CuBOL technology: A low cost flipchip technology solution scalable to high I/O density, fine bump pitch and Advanced Si-nodes" Electronic Components and Technology Conference Proceedings,2011pp.602-607.
8. Rabindra N. Das, Frank D. Egitto, Barry Bonitz, Mark D. Poliks and Voya R. Markovich , "Package-interposer-package (PIP): A breakthrough PoP technology for high end electronics" Electronic Components and Technology Conference Proceedings,2011pp.619-24