Development of electronic substrates for medical device applications

IMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference

Volumn , Issue , 2012, Pages

  Egitto, Frank D ^a   Das, Rabinclra N ^a   Marconi, Francesco ^a   Wilson, Bill ^a   Markovich, Voya R ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROPRIATE MATERIALS; ELECTRONIC SUBSTRATES; FLEXIBLE MATERIALS; FLEXIBLE PACKAGINGS; HIGH-SPEED PERFORMANCE; INNOVATIVE APPROACHES; MICROELECTRONICS INDUSTRY; PACKAGING STRUCTURE;

BIOMEDICAL EQUIPMENT; CHIP SCALE PACKAGES; COPPER; EXHIBITIONS; MEDICAL APPLICATIONS; MICROELECTRONICS;

PACKAGING;

EID: 84877972362     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Diagnostic and Invasive Cardiology, January/February 2009 Issue, Reilly Communications Group.
2. For discussion of frame mounting of flexible films, see, e.g., Durocher, et al., US Patent 6, 994, 897 (2006).
3. National toxicology program Report Number IMM90006, "Contact Hypersensitivity studies in Female B6C3F1 mice" US department of health and human services.
4. Duffy D.C., OJA Schueller, ST Brittain, GM Whitesides, J. Micromech Microeng 9: 211 (1999).
5. Jo B-H., Lerberghe L.M., Motsegood K.M., Beebe D.G., J. Microelectro-mech Syst. 9:22 (2000).
6. Xia Y., Whitesides G. M., Angew Chem Int Ed 37, 1998, pp.550.