A 77-GHz SiGe single-chip four-channel transceiver module with integrated antennas in embedded wafer-level BGA package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 1027-1032

  Wojnowski, M ^a   Wagner, C ^b   Lachner, R ^a   Bock J ^a   Sommer, G ^a   Pressel, K ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b DICE GmbH & Co KG   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

BGA PACKAGE; CHIP PACKAGE CODESIGN; COPLANAR STRIPS; FOUR-CHANNEL; FULLY OPERATIONAL; GROUND PLANES; HALF-WAVE DIPOLE; INTEGRATED ANTENNAS; MM-WAVE; RADIATING ELEMENTS; REDISTRIBUTION LAYERS; SILICON GERMANIUM; SINGLE-CHIP; STANDARD BALL; SYSTEM-IN-PACKAGE APPLICATIONS; TRANSCEIVER CHIPS; TRANSCEIVER MODULES; WAFER LEVEL;

MILLIMETER WAVES; ORGANIC POLLUTANTS; RADAR SYSTEMS; REFLECTION; SILICON ALLOYS; TRANSCEIVERS;

ANTENNAS;

EID: 84866869789     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6248962     Document Type: Conference Paper

References (12)

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