Dynamic bending test analysis of inkjet-printed conductors on flexible substrates

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 80-85

  Halonen, Eerik ^a   Halme, Aki ^a   Karinsalo, Tapio ^a   Iso Ketola, Pekka ^a   Mäntysalo, Matti ^a   Mäkinen, Riku ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING ANALYSIS; CIRCUIT BOARDS; DYNAMIC BENDING TEST; ELECTRONIC DEVICE; FLEXIBLE CIRCUIT; FLEXIBLE SUBSTRATE; INK-JET TECHNIQUE; MANUFACTURING METHODS; ON DYNAMICS; POLYMER SUBSTRATE; POROUS STRUCTURES; POTENTIAL TECHNIQUES; PRINTED ELECTRONICS; PRINTED STRUCTURES; REAL TIME; SILVER CONDUCTORS; SUBSTRATE MATERIAL; THIN LAYERS;

COPPER; INDUSTRIAL RESEARCH; INK; MANUFACTURE; SINTERING;

SUBSTRATES;

EID: 84866866286     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6248810     Document Type: Conference Paper

References (11)

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