Automated modeling and fatigue analysis of flexible printed circuits

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Ptchelintsev, Alexander ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; SENSITIVITY ANALYSIS;

ABAQUS/CAE; AUTOMATED MODELING; FATIGUE ANALYSIS; FLEXIBLE PRINTED CIRCUITS (FPC);

PRINTED CIRCUITS;

EID: 33847174247     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1643955     Document Type: Conference Paper

References (5)

1. Merchant, H.D., et al, "Mechanical Fatigue of Thin Copper Foil," Journal of Electronic Materials, Vol. 2, No. 9, 1999.
2. Hutchinson, J. W., "Plasticity at the micron scale", International Journal of Solids and Structures 37 (2000) 225±238.
3. Low T. H., Pang J.H. L., Lin C. W. C., Chiang S. C. L. and Yang T. K. A., "Modeling Plated Copper Interconnections in a Bumpless Flip Chip Package", Electronics Packaging Technology Conference, 2003
4. Norman E. Dowling, Mechanical Behavior of Materials: Engineering Methods for Deformation, Fracture, and Fatigue (2nd Edition).
5. OPTIMUS 5.1 Documentation - Version 1.0 (July 2005)